Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
New Equipment | Solder Materials
AuSn solder electroplating is a key technology developed by Micralyne to lower your production costs and give you a better MEMS product. This state-of-the-art, patented process for electroplating AuSn solder alloy is a giant step forward in electropl
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2022-05-18 12:53:24.0
BTU International, Inc. is pleased to announce that Bob Bouchard, Director of Sales, will present at the SMTA Michigan Expo & Tech Forum. The presentation entitled, "Vacuum Reflow Thermal Profile Challenges" will take place Tuesday, May 17, 2022 at the Laurel Manor Banquet & Conference Center in Livonia, MI.
Industry News | 2004-10-26 20:19:02.0
Passive Cooling of Intel XEON Processors
Industry News | 2007-07-13 16:00:10.0
Release of latest version of Micro system
Industry News | 2019-11-05 22:10:56.0
Many customers and electronic designers were asking questions about the aluminum-based board, today our chief technical official Luca Zhang shared the knowledge and experience to you.
Industry News | 2017-02-28 20:41:01.0
PDR is pleased to introduce the new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems. The PDR IR-TS One Bench Top System and TS-2100 Cabinet System have been designed to thermally cycle key critical components and assemblies to detect defects. Applications include testing electronic assemblies, electronic devices, bonded structures of plastics and ceramics in a wide variety of fields, including medical, automotive, avionics, space and defense.
Industry News | 2017-06-20 20:15:03.0
PDR introduces the benchtop based PDR IR-TS One IR Thermal Test System, designed to thermally cycle key critical components and assemblies to detect defects. Using PDR’s unique Non-Destructive Dual Thermal Stress Screening Process, based on a variation on HALT/HASS principles, the system is able to focus the testing on suspected problem areas to safely screen out early field failures caused by design, environmental, production and structural defects.
Commercial-off-the-shelf (COTS) PC/104 and PC/104-Plus computer cards and components, including x86 and PowerPC CPUs; DC/DC converter power supplies and interfaces; fan cards and heatsinks; digital I/O and mass storage boards; fieldbus interfaces (C
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