Industry News | 2011-11-27 00:48:58.0
Nordson DAGE announced its new Materials testing capability on the 4000Plus at the Productronica exhibition.
Industry News | 2020-03-08 16:08:22.0
PVA will demonstrate its latest products – Sigma and MR1 at booth 1004 at the Adhesive & Bonding Expo. The expo is scheduled to take place March 24-26, 2020 at the Suburban Collection Showplace in Novi, MI.
Industry News | 2007-09-14 09:28:37.0
Chalman Technologies is new CT USA Representative
EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle
Tachyon-100G laminate materials are designed for very high-speed digital applications up to and beyond speeds of 100 Gb/s. Tachyon 100-G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature
Industry News | 2014-10-14 11:36:35.0
AI Technology, Inc (AIT) Develops Conformal Coatings to Protect Electronics in Extreme Environments. AI Technology (AIT) is proud to present its improved Prima Protect™ coating line for moisture and salt fog protection.
Industry News | 2023-12-11 12:32:10.0
Indium Corporation R&D Sintering Project Manager Demi Yao will deliver a presentation on pressure-less copper sintering paste for die-attach applications at the Electronics Packaging Technology Conference (EPTC) on December 8 in Singapore.
Events Calendar | Wed Aug 16 00:00:00 EDT 2017 - Sat Aug 19 00:00:00 EDT 2017 | Harbin, China
ICEPT 2017, The 18th International Conference on Electronic Packaging Technology
Industry News | 2022-03-30 14:59:52.0
YINCAE is excited to announce that we have developed DA158N die attach materials which is thermal conductive and electrical insulating adhesives. It can be fast cured at low temperature. The development of DA 158N is preparing the materials for people to live in the Mars.
Industry News | 2010-02-19 09:45:37.0
Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding
