Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance
Industry News | 2017-04-23 11:18:17.0
PDR, a leader in IR rework, test and inspection, is pleased to announce that Horizon Sales will discuss its new PDR IR-TS Series of micro-focused HALT/HASS thermal test systems at the SMTA Wisconsin Expo & Tech Forum, scheduled to take place Tuesday, May 2, 2017 at the Milwaukee Airport Crowne Plaza in WI. Horizon Sales is PDR’s exclusive representative in the Midwestern U.S.
Industry News | 2023-04-11 10:04:21.0
BTU International, Inc. will exhibit in Hall 4A, Stand 210 at SMTconnect, scheduled to take place May 9-11, 2023 in Nuremberg, Germany. At the show, BTU will show its brand new Profile Tracer, a next-generation thermal profiling tool providing real-time data acquisition for oven optimization by identifying inconsistencies due to temperature variables at both the product level and at the heat source.
Industry News | 2021-03-06 03:21:15.0
The Assembly Solutions division of MacDermid Alpha Electronics Solutions, a world leader in the production of electronics soldering and bonding materials, will introduce ALPHA® OM-372 its latest ultra-fine feature solder paste innovation at Productronica China at the Shanghai New International Expo Centre in Shanghai, China from March 17-19.
Industry News | 2017-11-07 17:14:32.0
Nordson Corporation (NASDAQ: NDSN) announces that eight divisions from its Advanced Technology segment will be exhibiting together at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, stands 245, 345, and 445.
Industry News | 2013-09-05 20:26:22.0
Engineered Material Systems , a leading global supplier of electronic materials for circuit assembly applications debuts its CA-195 High Thermal Conductivity, Low Cost Electrically Conductive LED Die Attach Adhesive for attaching LED and other small semiconductor die to silver and copper lead frames.
Industry News | 2019-04-15 06:39:46.0
Indium Corporation will feature its InFORMS® ESM02, a reinforced solder fabrication designed to produce consistent bondline thickness for die-level attach applications, at PCIM 2019, May 5-7, Nuremberg, Germany.
Industry News | 2023-04-17 08:45:54.0
BTU International, Inc. received a 2023 EM Innovation Award in the category of Software – Process Control for its new Profile Tracer. The award was announced at a ceremony that took place April 14, 2023 during productronica China in Shanghai.
Industry News | 2023-10-02 10:16:26.0
BTU International, Inc. is pleased to announce its participation in the SMTA Space Coast Expo & Tech Forum, scheduled to take place Wednesday, Nov. 1, 2023 at the Melbourne Auditorium in Florida. BTU International will highlight process control features and options including the Profile Tracer oven profiler and the Profile Guardian redundant monitoring system.
Industry News | 2010-03-24 13:39:18.0
MARTIN, a FINETECH company, will demonstrate the Reball 03.1 unit in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.
