Industry News | 2010-05-29 18:57:32.0
MARTIN will demonstrate the Reball/Prebump 03.1 unit at the upcoming SMTA Upper Midwest Expo, scheduled to take place Wednesday, June 9, 2010, at the Sheraton Bloomington Hotel in Bloomington, MN. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2010-06-30 12:09:49.0
MARTIN will demonstrate the Reball / Prebump 03.1 unit at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled for Wednesday, July 14, 2010 at the Doubletree Hotel in Cleveland, OH. This standalone unit is an easy and cost effective solution for BGA reballing and QFN solder bumping.
Industry News | 2010-09-15 21:55:19.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.
Industry News | 2010-10-04 15:37:18.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming Central Texas Electronics Association (SMTA/IMAPS) Expo & Tech Forum, scheduled to take place, October 7, 2010 at the Norris Conference Centers in Austin, TX.
Industry News | 2010-11-18 11:04:08.0
MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Arizona-Sonora Expo & Tech Forum, scheduled to take place Wednesday, December 1, 2010 at the Fiesta Inn Resort & Conference Center in Tempe, AZ.
Industry News | 2011-05-10 19:11:40.0
MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming Space Coast Expo and Tech Forum, scheduled to take place June 9, 2011 at the Melbourne Auditorium in Melbourne, FL.
Industry News | 2012-02-15 19:12:30.0
Engineered Material Systems has released its new DA-5045-2 and DA-5045-4 High Thermal Conductivity Die Attach Adhesives for attaching light emitting diodes (LEDs) and small die.
Industry News | 2021-03-29 13:46:10.0
Advanced New Capabilities Enable AI-Equipped Cameras/Vision Solutions for Surveillance, Fleet Management, Smart City and Industrial Equipment Industries
Industry News | 2012-02-22 01:32:21.0
Engineered Material Systems introduces its DE-7826 (dam) and CE-7826 (fill) Dam and Fill Chip Encapsulants for chip-on-board (COB) applications.
Industry News | 2015-09-22 20:26:53.0
BTU International today announced that it will exhibit at Heat Treat 2015, ASM’s Heat Treating Society Conference & Exhibition, scheduled to take place Oct. 21-22, 2015, at the Cobo Convention Center in Detroit, MI. BTU will highlight its controlled atmosphere furnaces in Booth #449.
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