Industry News | 2017-11-23 08:24:16.0
BTU International will exhibit at the SMTA Silicon Valley Expo & Tech Forum, scheduled to take place Wednesday, Nov. 29, 2017 at Bestronics, Inc. in San Jose, CA. BTU will discuss its new Profile Guardian redundant process monitor to support Industry 4.0 and award-winning PYRAMAX platform.
Industry News | 2018-02-19 13:46:00.0
BTU International will demonstrate its TrueFlat technology in the CohPros International Co., Ltd, booth #N2, 2613 at SEMICON China, scheduled to take place March 14-16, 2018 at the Shanghai New International Expo Centre.
Industry News | 2018-02-20 17:53:30.0
BTU International will exhibit at productronica China, scheduled to take place March 16-18, 2018 at the Shanghai New International Expo Centre. The company will showcase the PYRAMAX™ 125N Dual Lane Reflow Oven in Booth # E2, 2120 in the SMT Innovation Area.
Industry News | 2018-09-19 21:04:12.0
BTU International,will exhibit in Booth #430 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. At the show, the company will discuss the latest software version – WINCON™ 7.0. New features of the latest software release include:
Industry News | 2022-12-14 12:30:03.0
BTU International, Inc. is excited to announce the launch of its new profiling technology at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. As a result of the company's strategic partnership with iRaptor, BTU has developed its new iRaptor Profiling Technology that will debut for the first time at the show in Booth #2322.
Industry News | 2023-09-04 14:03:03.0
BTU International, Inc. will highlight its TrueFlat™ reflow oven technology at SEMICON Taiwan in booth #M1039. The expo is scheduled to take place September 6-8, 2023 at TaiNEX 1 & 2 in Taipei.
Industry News | 2022-05-18 12:32:37.0
Heraeus Electronics today announced the launch of its new Condura®.ultra Ag free AMB Substrate. A cost-efficient, highly reliable, Ag free AMB substrate that enables bonding silicon-nitride-based ceramics with copper foils, Condura®.ultra was developed using a special technique enabling high-performance Si3N4 substrates by using new, Ag free active metal brazing (AMB) bonding technology.
Industry News | 2014-01-09 10:39:28.0
Engineered Material Systems is pleased to debut its 535-10M-45 UV Cured Epoxy Adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2014-03-31 16:21:29.0
Engineered Material Systems debuts its 535-10M-49 UV cured epoxy adhesive formulated for disk drive, camera module, optoelectronic and circuit assembly applications.
Industry News | 2015-10-19 12:58:40.0
Morgan Advanced Materials announces it has received a favorable letter of opinion from the U.S. Food and Drug Administration (FDA) for a variety of its carbon/graphite, sintered silicon carbide, and reaction bonded silicon carbide materials produced by its Seals and Bearings business. The letter of opinion covers repeated-use, wear components for food applications, including mechanical face seals, bearing, bushings, vanes, and rotors.
