Full Site - : fpga thermal bonding (Page 22 of 59)

Indium Corporation Features 'Power-Safe' NC-SMQ®75 Die-Attach Solder Paste at SEMICON China

Industry News | 2016-02-20 20:36:54.0

Indium Corporation will feature "Power-Safe" NC-SMQ®75, the world’s first and only die-attach solder paste suitable for use in non-cleaned clip bond applications in power semiconductor die-attach applications, at SEMICON China March 15-17, 2016, in Shanghai, China.

Indium Corporation

Indium Corporation Expert to Present at IEM

Industry News | 2022-01-29 13:20:07.0

Durafuse™, Indium Corporation's award-winning mixed-alloy technology, will be the focus of a virtual presentation by Dr. HongWen Zhang for the Institution of Engineers, Malaysia at 8 a.m. New York/9 p.m. Malaysia on Thursday, Feb. 24.

Indium Corporation

BTU Launches New TrueFlat Technology to End Die Tilt at SEMICON Taiwan

Industry News | 2017-08-26 20:24:13.0

BTU International today announced plans to introduce its new TrueFlat technology, an optional configuration of the PYRAMAX™ convection reflow oven. The unique technology for substrate flatness will be introduced for the first time in Booth 1314 at SEMICON Taiwan, scheduled to take place Sept. 13-15, 2017 at the Taipei Nangang Exhibition Center in Taipei, Taiwan.

BTU International

BTU Picks Up Two Mexico Technology Awards

Industry News | 2018-11-16 16:35:37.0

BTU International announces that it was awarded two 2018 Mexico Technology Awards during the SMTA Guadalajara Expo & Tech Forum. The awards were presented to the company for its PYRAMAX™ Vacuum reflow oven and TrueFlat technology during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

BTU International

BTU International to Be Featured at the SEMICON West Smart Manufacturing Pavilion

Industry News | 2019-06-30 21:12:33.0

BTU International today announced that it will have a PYRAMAX 100A at the SEMICON West Smart Manufacturing Pavilion. The event is scheduled to take place July 9-11, 2019 at the Moscone Center in San Francisco, CA. The smart manufacturing data-sharing will be enabled by Cimetrix’s Sapience product which runs on the SECS/GEM framework. BTU has supported SECS/GEM protocol for many years and is well-versed in this standard.

BTU International

BTU Surpasses 50 Industry Awards

Industry News | 2022-07-25 08:28:19.0

BTU International, Inc. today announced that it was awarded two 2022 EM Innovation Awards. The company was awarded in the categories of Soldering – Auxiliary Systems for its Trueflat Technology and Selective Soldering for its Valence 3508 selective soldering system. With these two awards, the company marks 51 industry awards for its thermal processing equipment.

BTU International

BTU International Partners with SMarTsol to Showcase Locally Built Pyramax Reflow Oven at SMTA Guadalajara Expo

Industry News | 2023-09-25 19:03:21.0

BTU International, Inc. is joining forces with SMarTsol Technologies at the upcoming SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara in Jalisco, Mexico. The spotlight of the event will be the locally built Pyramax 125 Air model, representing the recently announced reflow oven manufacturing capabilities available now in Mexico.

BTU International

BTU International Redefines Operational Value and Efficiency with the Aurora Platform of Reflow Ovens

Industry News | 2024-03-26 13:05:01.0

BTU International, Inc. is proud to announce that its new Aurora platform of reflow ovens is designed to minimize the Cost of Ownership (CoO) while maximizing performance and operational value for its users. With a focus on precision, consistency, and efficiency, the Aurora platform sets a new standard for thermal processing in electronics manufacturing.

BTU International

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America


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