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Henkel Assembly Paste Adhesives

Henkel Assembly Paste Adhesives

New Equipment | Materials

Henkel's diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive diel

Henkel Electronic Materials

A Novel Epoxy Flux On Solder Paste For Assembling Thermally Warped POP

Technical Library | 2017-08-17 12:23:27.0

A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.

Indium Corporation

AI Technology, Inc (AIT) Introduces 3D-TSV Ultra-Thin Wafer Processing Temporary Bonding Adhesive Film

Industry News | 2015-03-20 09:51:33.0

THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION

AI Technology, Inc. (AIT)

Tech Days 2017

Tech Days 2017

Videos

Those were the Scheugenpflug TechDays 2017! https://www.scheugenpflug.de/en/news/press-releases/article/scheugenpflug-techdays-2017-with-record-attendance-123.html From potting batteries and electric engines to new, high temperature resistant potti

Scheugenpflug Inc.

CAD Design Software

Industry Directory | Consultant / Service Provider

CAD Design Software products run in the AutoCAD environment.

MPIQC

Industry Directory | Manufacturer

MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

PCT 25KV RF disk ceramic capacitor

PCT 25KV RF disk ceramic capacitor

Parts & Supplies | AOI / Automated Optical Inspection

RF High Power Ceramic Capacitor 5KV~30KV/100pf~6000pf HV RF Disk / Plate ceramic capacitor, RF Barrel / Doorknob Capacitor, RF Feedthrough Capacitor, High Voltage Plate Ceramic Capacitor, High Power Ceramic Capacitor Manufacture Supply High Voltage

Shanghai Imax Electronic Co.,ltd

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-05-07 16:11:10.0

AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.

AI Technology, Inc. (AIT)

TEMS, LLC.

New Equipment |  

TEMS� is focused on providing innovative value based solutions to our customers. We offer design & manufacturing solutions for the protection of electronic & electrical assemblies. At TEMS� , we have over 25 years of experience in the adhesives, se

TEMS, LLC.


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