Industry News | 2014-08-16 17:55:06.0
Toddco General, Inc. released the new TG-1000 bonding platform to easily support large display panels or other substrates requiring hot bar bonding of flexible circuits, TABs, COF or COG. Designed for process development labs, high-mix production or repair environments.
Events Calendar | Tue Sep 10 00:00:00 EDT 2019 - Thu Sep 12 00:00:00 EDT 2019 | Novi, Michigan USA
Battery Show
The Dos P016 / 050 / 100 / 300 / TCA piston dispensers are high-precision volumetric dispensers designed to process 1C and 2C materials and cover a wide range of applications. Precisely dimensioned dispensing cylinders provide the ability to obtain r
Industry News | 2013-06-12 18:03:39.0
Engineered Material Systems, announces the debut of its 357-284 Wire Bond Encapsulant and Flexible Circuit Bonding Adhesive for printer head and circuit assembly applications.
Industry News | 2023-10-23 09:52:43.0
TopLine's CCGA Column Grid Array IC packages and large Ball Grid Array (BGA) package solutions will highlight the company's exhibit at Productronica 2023. TopLine will exhibit in Hall A4.460, and the solutions offered by TopLine will include Bonding Wire, CCGA solder columns, IC Chip Trays, Daisy Chain Dummy Components, and PCB Jumpers.
Industry News | 2014-09-05 13:53:06.0
AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.
Technical Library | 2016-11-17 14:37:41.0
With increasing LED development and production, thermal issues are becoming more and more important for LED devices, particularly true for high power LED and also for other high power devices. In order to dissipate the heat from the device efficiently, Au80Sn20 alloy is being used in the industry now. However there are a few drawbacks for Au80Sn20 process: (1) higher soldering temperature, usually higher than 320°C; (2) low process yield; (3) too expensive. In order to overcome the shortcomings of Au80Sn20 process, YINCAE Advanced Materials, LLC has invented a new solderable adhesive – TM 230. Solderable adhesives are epoxy based silver adhesives. During the die attach reflow process, the solder material on silver can solder silver together, and die with pad together. After soldering, epoxy can encapsulate the soldered interface, so that the thermal conductivity can be as high as 58 W/mk. In comparison to Au80Sn20 reflow process, the solderable adhesive has the following advantages: (1) low process temperature – reflow peak temperature of 230°C; (2) high process yield – mass reflow process instead of thermal compression bonding process; (3) low cost ownership. In this paper we are going to present the die attach process of solderable adhesive and the reliability test. After 1000 h lighting of LED, it has been found that there is almost no decay in the light intensity by using solderable adhesive – TM 230.
Technical Library | 2017-10-16 15:03:32.0
The miniaturization and advancement of electronic devices have been the driving force of design, research and development, and manufacturing in the electronic industry. However, there are some issues occurred associated with the miniaturization, for examples, warpage and reliability issues. In order to resolve these issues, a lot of research and development have been conducted in the industry and university with the target of moderate melting temperature solder alloys such as m.p. 280°C. These moderate temperature alloys have not resolve these issues yet due to the various limitations. YINCAE has been working on research and development of the materials with lower temperature soldering for higher temperature application. To meet this demand, YINCAE has developed solder joint encapsulant paste to enhance solder joint strength resulting in improving drop and thermal cycling performance to eliminate underfilling, edge bonding or corner bonding process in the board level assembly process. This solder joint encapsulant paste can be used in typical lead-free profile and after reflow the application temperature can be up to over 300C, therefore it also eliminates red glue for double side reflow process. In this paper, we will discuss the reliability such as strength of solder joints, drop test performance and thermal cycling performance using this solder joint encapsulant paste in detail.
Industry News | 2018-11-13 21:03:43.0
Analog Devices. Inc. (ADI) announces the launch of Power by LinearTM LTC3310S.This is a 5V, 10A low EMI monolithic synchronous buck converter. The fixed frequency peak current mode architecture of this electronic component is ideal for high step-down ratio applications that require fast transient response.
Industry News | 2013-06-03 11:00:12.0
The smaller the circuit board, the less space there is to connect the individual components. Wire bonding provides a very reliable alternative to soldered connections, and it is with this approved method that Würth Elektronik is expanding its service portfolio and taking a further step towards becoming a global circuit board systems company.
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