New SMT Equipment: fr nano (3)

Schneider Plc

Schneider Plc

New Equipment | Other

AS-BADU-204 AS-BADU-205 AS-HDTA-200C AS-HDTA-201 AS-HDTA-201C AS-HDTA-202 AS-HDTA-202C AS-MBKT-085 AS-MBKT-185 AS-MBPL-001 AS-MEEP-000 AS-MEEP-001 AS-P120-000 AS-P120-125 AS-WBXT-201 AS-WBXT-203 AS-BADU-206 AS-BADU-210 AS-BADU-211

Zhengzhou Weilin Electronic Technology Co., ltd

GE BENTLY NEVADA 330710-000-060-10-02-00 Probe

GE BENTLY NEVADA 330710-000-060-10-02-00 Probe

New Equipment | Industrial Automation

  Sandy.[mailto:unity@mvme.cn]    Sandy.[WhatsApp/Skype/Mobile:+8618020776786]     Sandy.[Quote to you within the shortest possible time with our best price]   Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Electronics Forum: fr nano (1)

Questions you would ask if someone said they had a 3D printer for professional multi-layer PCBs?

Electronics Forum | Sun Mar 01 04:24:06 EST 2015 | 3dpcb

Thanks Sarason, You are right that chemists and physicists now have some new tricks. Using nano-chemistry the physical properties of the materials change. The melting temperature of our nano-particle silver is below 150C. The insulator is also a nano

Industry News: fr nano (3)

Tropical Stencil Enhances Products, Adds Full-Service Sourcing

Industry News | 2012-09-24 16:23:06.0

Tropical Stencil, a leading provider of laser cut stencils, recently has added several new product enhancements, along with full service printed circuit board (PCB) sourcing.

Tropical Stencil

Indium Corporation Technology Expert to Present at Brasage

Industry News | 2014-05-13 17:01:55.0

Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.

Indium Corporation

Express Newsletter: fr nano (77)

SMTnet Express - November 26, 2017

SMTnet Express, November 26, 2017, Subscribers: 30,955, Companies: 13,080, Users: 23,968 Can Nano-Coatings Really Improve Stencil Performance? Tony Lentz; FCT ASSEMBLY, INC. Nano-coatings have been introduced by various manufacturers

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures

Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures Reliability Enhancement of Wafer Level Packages with Nano-Column-Like Hollow Solder Ball Structures by: Ronak Varia, Xuejun Fan; Lamar University

Partner Websites: fr nano (74)

Journal of SMT Articles

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm

J. Turbini Abstract 26-2 Solder Alloy Creep Constants for Use in Thermal Stress Analysis Robert Darveaux, Ph.D. and Corey Reichman Abstract 26-2 A Nano Silver Replacement for High Lead Solders in Semiconductor Junctions Keith Sweatman, Tetsuro

Surface Mount Technology Association (SMTA)


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