New Equipment | Education/Training
The J-STD-001 Space Electronics Hardware Addendum provides additional requirements over those published in IPC J-STD-001 to ensure the reliability of soldered electrical and electronic assemblies that must survive the vibration and thermal cyclic env
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Electronics Forum | Thu Jun 24 23:57:42 EDT 2004 | George
Could anyone tell me the difference in PCB material Nelco13 and FR4? PCB dielectric material Nelco13 is quite new for me and I knew nothing about it. For imcoming quality control (IQC), I am asked to identify PCB made of FR4 and Nelco13. How to do th
Electronics Forum | Mon Jun 28 01:44:02 EDT 2004 | George
Thanks a lot !
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Parts & Supplies | Pick and Place/Feeders
Which series nozzles could be used for Phlips Topaz and Emerald machine As we know, many parts are compatible for Yamaha and Philips machines, but some models their nozzles are not generic.So which series nozzles could be used for Phlips Topaz and
Technical Library | 2013-10-31 17:36:41.0
Multilayer printed circuit boards (PCBs) that utilize high performance materials are inherently far more challenging for a fabricator to build, due to significant material property differences over standard epoxy glass FR4. These unique material characteristics often require higher processing temperatures, special surface treatments (to aid in hole and surface plating), they possess different expansion properties, making layer-to-layer registration more difficult to control, and require many other unique considerations.
Technical Library | 2008-02-04 12:13:38.0
Engineers are always striving to make a lighter, faster and stronger PCB. In order to achieve their designs, engineers must turn to alternative materials to enhance their designs. There are many materials that allow for thermal, coefficient of thermal expansion (CTE) and rigidity. Many times if a material enables an engineer to have CTE they will have to sacrifice thermal. Currently carbon composite laminates are being used in order to achieve an ideal PCB with thermal, CTE and rigidity with almost no weight premiums.
Harnessing gravity LiquiPrep variant uses gravity for high-viscosity materials The higher the viscosity of a material, the greater the demands it places on its preparation and feeding in dispensing systems. But the trend right now is to use viscou
Events Calendar | Tue May 17 00:00:00 EDT 2022 - Thu May 19 00:00:00 EDT 2022 | Amsterdam, Netherlands
Electronics in Harsh Environments Conference and Exhibition
Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,
SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/thermal-interface-material-tim
Series is designed for medium- and large-volume dispensing applications in Electronics Assembly, including Thermal Interface Material (TIM
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_fr4_topic2234.xml
PCB Libraries Forum : FR4 PCB Libraries Forum : FR4 This is an XML content feed of; PCB Libraries Forum : PCB Design Basics : FR4 FR4 : The base material, or substrate
