Industry Directory | Consultant / Service Provider / Distributor / Manufacturer
ORION provides innovative solutions to our customers' EMI/RFI Shielding, Insulating, Screening and Sealing needs in a broad spectrum of manufacturing environments.
Industry Directory | Association / Non-Profit / Events Organizer / Training Provider
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
We are well versed in the following thermal application materials: Sil-Pad thermally conductive insulators Gap-Pad thermally conductive gap filling material Q-Pad thermal grease replacement film Bond-Ply thermally conductive adh
Electronics Forum | Wed Mar 10 16:18:29 EST 1999 | greg cronin
I am looking for a supplier for bare fr4 material. I use the fr4 for fixtures and my supply has run out. A supplier in the new england area would be the best. thank you
Electronics Forum | Wed Mar 10 18:37:27 EST 1999 | Earl Moon
| I am looking for a supplier for bare fr4 material. I use the fr4 for fixtures and my supply has run out. A supplier in the new england area would be the best. | thank you | New England Laminate Co (NELCO) and Polyclad in NH. Earl Moon
Used SMT Equipment | Soldering - Reflow
1. This product is made of imported stainless steel materials from Japan and is enclosed with the original Nano insulation materials from the United States. 2. This product has an extremely long service life. The general time is three to five years
Used SMT Equipment | Pick and Place/Feeders
Universal Instruments Polaris Machine For Sale Very clean and in Good Condition See attached pictures and information below Polaris Model Number: 7514A Equipment Number: 10076306 Year 2008 Travel: 550 mm x 800mm Repeatability: +/- 0.01
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2011-01-12 17:48:44.0
GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #6111 at the upcoming Automation and Technology West Expo (ATX), scheduled to take place February 8-10, 2011 at the Anaheim Convention Center in Anaheim, CA.
Parts & Supplies | Assembly Accessories
PC12P Inventory Material: Copper Clad FR4, Single Sided, 2 oz. Series: - Size Dimension: 18.00" x 12.00" (457.4mm x 304.8mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: Copper Clad, Positive Sensitized PC12P-E RFQ
Parts & Supplies | Tape and Reel
SMT Kapton Tape Polymide film tape Specifications: Antistatic Thermally conductive Polyimides for fine line circuitry Cryogenic insulation Corona resistant Pigmented for color Conformable Other films tailored to meet customers needs Param
Technical Library | 2023-01-17 17:12:33.0
Reflowed indium metal has for decades been the standard for solder thermal interface materials (solder TIMs or sTIMs) in most high-performance computing (HPC) TIM1 applications. The IEEE Heterogeneous Integration Thermal roadmap states that new thermal interface materials solutions must provide a path to the successful application of increased total-package die areas up to 100cm2. While GPU architectures are relatively isothermal during usage, CPU hotspots in complex heterogeneously-integrated modules will need to be able to handle heat flux hotspots up to 1000W/cm2 within the next two years. Indium and its alloys are used as reflowed solder thermal interface materials in both CPU and GPU "die to lid/heat spreader" (TIM1) applications. Their high bulk thermal conductivity and proven long-term reliability suit them well for extreme thermomechanical stresses. Voiding is the most important failure mode and has been studied by x-ray. The effects of surface pretreatment, pressure during reflow, solder flux type/fluxless processing, and preform design parameters, such as alloy type, are also examined. The paper includes data on both vacuum and pressure (autoclave) reflow of sTIMs, which is becoming necessary to meet upcoming requirements for ultralow voiding in some instances.
Technical Library | 2024-08-20 00:41:48.0
Thermal interface materials (TIMs) play a pivotal role in ensuring efficient thermal management by facilitating heat transfer between heat generating components and heat-dissipating devices
Two-axis PCB Separator ML-850 Features。 ● Suitable for verically designed PCB with V-scored groove. ● 49 sets of PCB data can be stored. ● PCB material:FR4.Aluminum,Copper.etc. ● Dust collection system optional. ● X-axis and Yaxis bladeunits llow fo
Share PCBA Photos for Better Separation Solutions ! Morel—PCB Separator Specialist Kindly share your requirements with us ! Features Suitable for horizontal designed PCB with V-scored groove. PCB material:FR4,Aluminum,Copper,et
Training Courses | | | IPC J-STD-001 Space Trainer (CIT)
The IPC J-STD-001 Space Addendum (CIT) certification courses allow individuals to conduct Certified IPC J-STD-001 Space Addendum Specialist (CIS) training.
Training Courses | | | IPC J-STD-001 Space Specialist (CIS)
The J-STD-001 Space Addendum is an additional optional module for the Certified IPC J-STD-001 CIS (Specialist) program for organizations that are required to meet these additional requirements.
Events Calendar | Fri Jul 15 00:00:00 EDT 2022 - Fri Jul 15 00:00:00 EDT 2022 | ,
Multi Chapter/Continent Webinar Series: Thermal Interface Solutions (Presented by Empire Ch.)
Events Calendar | Fri Jul 22 00:00:00 EDT 2022 - Fri Jul 22 00:00:00 EDT 2022 | ,
Multi Chapter/Continent Webinar Series: Thermal Interface Solutions (Presented by India Ch.)
Career Center | Rochester, New York USA | Engineering
Our high tech client located in the Western NY State area offers you the following challenge. Complete mechanical design responsibility from specification to the manufacturing process. We seek a candidate that has the following experience: Design
Career Center | Crawfordsville, Indiana USA | 2015-06-08 15:47:37.0
Requisition: 1705 Job Title: Process Engineer Company Summary: Acuity Brands, Inc. is a North American Market Leader and one of the world's leading provideres of lighting solutions for both indoor and outdoor applications. Our Crawfordsville Faci
Career Center | Stoneham, Massachusetts | Engineering,Production,Research and Development,Technical Support
Warren P. Pumyea 8 Beacon Street Stoneham, Massachusetts 02180 Cell #: 978-821-7335 * E-mail: warren@pumyea.com http://www.pumyea.com/Process_Manufacturing_Engineer.doc Objective: Seeking a position as an engineer or related discipline whic
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/asymtek/fluid-types/thermal-interface-material-tim
Thermal Interface Material (TIM) | Nordson ASYMTEK ASYMTEK Products Corporate | Global Directory | Languages Division Only All of Nordson Fluid Dispensing Systems Jets
PCB Libraries, Inc. | https://www.pcblibraries.com/forum/RSS_fr4_topic2234.xml
PCB Libraries Forum : FR4 PCB Libraries Forum : FR4 This is an XML content feed of; PCB Libraries Forum : PCB Design Basics : FR4 FR4 : The base material, or substrate
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