Industry Directory: fr5 glass transition (1)

Dymax Corporation

Industry Directory | Manufacturer / Other

ISO certified global manufacturer and supplier of light-curable adhesives, coatings, oligomers, dispense systems, light-curing equipment, and technical consulting for the industrial, medical, and electronics industries.

New SMT Equipment: fr5 glass transition (7)

Axial Leaded Glass Encapsulated NTC Thermistor for Temperature Sensing, Measurement

Axial Leaded Glass Encapsulated NTC Thermistor for Temperature Sensing, Measurement

New Equipment | Components

Axial Glass NTC Thermistor Temperature Sensor is transition metal oxide material made semiconductor ceramic NTC Thermistor chip hermetically sealed in DO35 glass shell, with axial tinned Dumet wire, for temperature sensing measurement detection, indi

Amwei Thermistor Sensor

ThorLabs Inc. ASE-FL7200 Light Source Generators

ThorLabs Inc. ASE-FL7200 Light Source Generators

New Equipment | Test Equipment

ThorLabs Inc. ASE-FL7200 ASE FL 7200 White Light Test Source The ThorLabs ASE-FL7200 is a high-brightness white light test source. This high-brightness test source is designed to lproduce amplified spontaneous emission (ASE) ranging from 1440nm to

Test Equipment Connection

Electronics Forum: fr5 glass transition (43)

Tg - Glass transition temperature

Electronics Forum | Thu Jan 20 16:06:38 EST 2000 | Mike Naddra

Regarding glass transition , does anyone have expierance glass wiht transition temperature specification , such as what are the detrimental effects of exceeding the Tg , how long over the glass transition temperature ,if any , is acceptable. Tg of di

Re: Tg - Glass transition temperature

Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F

Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier

Industry News: fr5 glass transition (61)

IPC Releases E-Textiles Standard IPC-8921

Industry News | 2020-01-07 11:09:15.0

IPC-8921 establishes classifications and designations for woven and knitted e-textiles integrated with e-fibers, e-yarns and e-wires. It also standardizes key characteristics and durability testing for these materials as well as the industry test methods to be used to test against those characteristics.

Association Connecting Electronics Industries (IPC)

Isola Expands Commercial Production of I-Speed(R) PCB Materials Into Asia

Industry News | 2013-12-18 15:18:53.0

Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.

Isola Group

Technical Library: fr5 glass transition (8)

Effects of Tg and CTE on Semiconductor Encapsulants

Technical Library | 1999-07-21 08:49:49.0

As the role of direct-chip-attachment increases in the electronics industry, the reliability and performance of COB packaging materials becomes an increasing concern. Although many factors influence component reliability, the biggest determinants of performance are often the glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) of the encapsulant or underfill. This paper discusses exactly what these properties are, how they are measured, and why they are important to device-reliability.

Henkel Electronic Materials

Enhancing Mechanical Shock Performance Using Edgebond Technology

Technical Library | 2014-06-26 16:43:12.0

Edgebond adhesives have been widely used by the industry for improving the shock performance of area array packages. Most of the studies focus on the impact of material properties, such as coefficient of thermal expansion (CTE) and glass transition temperature (Tg), on reliability at room temperature. However, the operating temperature of a component on the printed circuit board bonded with edgebond adhesive can be close to or exceed Tg of the adhesive, where the material properties may be very different than at room temperature.

Cisco Systems, Inc.

Videos: fr5 glass transition (2)

MicroLine 1000 S

MicroLine 1000 S

Videos

The LPKF MicroLine 1000 S is perfect for cutting break-out tabs and complex contours at highest accuracy. The benefits include shorter time to market and much higher quality cuts than conventional methods. The machine's UV laser is an optimal tool fo

LPKF Laser & Electronics

Why are lasers so awesome? Because of our vacuum sintering oven auxiliary!

Videos

The industrial chain of laser processing has formed a complete ecological chain of laser processing from enterprises producing core lasers upstream to enterprises producing various kinds of laser processing equipment and then to enterprises providing

Beijing Technology Company

Express Newsletter: fr5 glass transition (89)

Partner Websites: fr5 glass transition (39)

PCB Libraries Forum : Determine Hole Size for Plastic Peg Alignment Pins

PCB Libraries, Inc. | https://www.pcblibraries.com/Forum/RSS_determine-hole-size-for-plastic-peg-alignment-pins_topic720.xml

(Glass Transition Temperature)... Author: Tom HSubject: 720Posted: 29 Dec 2012 at 2:51pmThe Tg (Glass Transition Temperature) relates to the PCB expansion in the "Y" axis or board thickness

PCB Libraries, Inc.

Selecting PCB Materials for Fabrication

Imagineering, Inc. | https://www.pcbnet.com/blog/selecting-pcb-materials-for-fabrication/

. In high-heat applications, it is essential that a board continues to work without losing functionality. Glass transition temperature (Tg

Imagineering, Inc.


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