Electronics Forum | Fri Jan 21 14:51:08 EST 2000 | Dave F
Mike: I�d hate to see you making design decisions, based solely on the discussion here, but that this would be an impetus to consult IPC-D-279, "Design Guidelines ... " and take a course on designing reliable boards. Werner Engelmaier (Engelmaier
Electronics Forum | Thu May 09 17:21:39 EDT 2002 | davef
In describing a bare board, you need to talk about base, laminate, and conductive materials. Common laminate materials are: * Glass fabric * Cotton fabric * Paper Common NEMA grades of technical laminates are: * Glass Fabric Grades: G3, G7, G10,
Electronics Forum | Tue Oct 11 17:27:49 EDT 2005 | artekeng
Depending on the metal and bond to FR4 you may be able to get a better profile if you use conductive heating.(vs standard convection reflow)
Electronics Forum | Wed Jan 10 15:11:18 EST 2018 | emeto
Copper has CTE of 17 which I think is closer to FR4 than Aluminum - 23, so in this aspect should be better. However, copper oxidizes very easily and is also 3 times heavier.
Electronics Forum | Wed Jul 18 08:00:48 EDT 2001 | davef
250C flass transition temperature - M = coloring agent or opacifier added to F resin with 110-150C glass transition temperature - N = natural color of resin - P = coloring agent or opacifier added to resin - T = natural color F resin blended with
Electronics Forum | Sun Jul 15 20:10:09 EDT 2001 | Danial
What is the best method to repair Warped PCBA. Obviuosly twisting it back to make it flat would be a disasterous. The method that I've tried wold be mounting the assembled board to the flat holder with the clamp and bake them at 120 Deg C for about 4
Electronics Forum | Thu Feb 03 13:23:30 EST 2005 | caldon
Hi Steve- We have a Glenbrook system and are pretty pleased with it....as far a value vs. cost it works great. I did have an issue with a Soic with a ground plane in the center...yes SOIC!!! The Ground plane was a heat sync that had vias for thermal
Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef
You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee
Electronics Forum | Mon Jul 26 19:32:03 EDT 1999 | Steve Gregory
| Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of
Electronics Forum | Fri Sep 10 09:03:52 EDT 1999 | ScottM
| | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the prec
