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Optical MEMS Finding Greater Opportunities in Non-Telecom Products

Industry News | 2003-07-02 09:35:30.0

As a result, sales of optical MEMS, into segments other than telecommunications, are forecast to grow at a CAGR of 15.8% over the next five years.

SMTnet

PCB East 2003 Announces Final Conference and Exhibition Program

Industry News | 2003-07-10 08:45:50.0

UP Media Group Inc. today announced the final schedule of events for the eighth annual PCB Design Conference East

SMTnet

MIRTEC Awarder AOI Contract With Victron, Inc At IPC Apex Expo 2011

Industry News | 2011-05-12 21:54:44.0

MIRTEC, "The Global Leader in Inspection Technology," announces that the company was awarded the contract to provide new AOI equipment to Victron, Inc. during the recent IPC APEX EXPO, which took place in Las Vegas in April 2011.

MIRTEC Corp

MIRTEC Announces Technical Collaboration Agreement with YXLON and The Comet Group

Industry News | 2018-08-21 20:05:28.0

MIRTEC, ‘The Global Leader in Inspection Technology’, is pleased to announce it has entered into a Technical Collaboration Agreement with YXLON, a company of the Comet Group. This collaboration allows both organizations to explore and expand upon synergistic applications within the SMT Electronics Manufacturing Industry.

MIRTEC Corp

MIRTEC TO EXHIBIT A NEW INSPECTION SYSTEM WITH THE PERFECT INSPECTION SOLUTION AT NEPCON CHINA 2017

Industry News | 2017-04-24 19:04:48.0

This year, MIRTEC will launch several new inspection machines equipped new cutting-edge technologies. MIRTEC is proud to be promoting these new machines in booth #1J10 at NEPCON China 2017, one of the biggest technical exhibitions of SMT and EMA, from April 25-27 at the Shanghai World EXPO Exhibition & Convention Center. MIRTEC’s new machines have been developed under a concept, ‘Perfect Inspection Solution’. This is an inspection concept involving the combination of 3D, 2D, and side-camera inspection.

MIRTEC Corp

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Altium Unveils New �Board-on-Chip� Technology

Industry News | 2003-04-30 08:37:19.0

Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs

SMTnet

InDigiNet To Acquire 2.5million in Assets

Industry News | 2003-05-08 07:11:45.0

InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.

SMTnet

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet


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