Industry News | 2016-03-18 10:45:49.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it received two awards at the 2016 IPC APEX EXPO. MIRTEC’s MV-6 OMNI 3D AOI system was recognized with a 2016 New Product Introduction (NPI) Award in the category of Test & Inspection – AOI. Additionally, MIRTEC received the prestigious 2016 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the awards to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, March 15, 2016 ceremony that took place at the Las Vegas Convention Center.
Technical Library | 2020-12-02 20:36:54.0
Industry 4.0 is a topic of much discussion within the electronics manufacturing industry. Manufacturers and vendors are trying to come to terms with what that means. In the most simplistic of terms, Industry 4.0 is a trend toward automation and data exchange within the manufacturing process. This basically requires connectivity and communication from machine to machine within the manufacturing line. The challenge is to collect data from each of the systems within the line and make that data available to the rest of the machines. Without test and inspection, there is no Industry 4.0. The whole purpose of test and inspection is to collect actionable data that may be used to reduce defects and maximize efficiency within the manufacturing line. The goal is to minimize scrap and get a really good handle on those process parameters that need to be put in place to manufacture products the right way the first time. For maximum efficiency, three inspection systems are required within the production line. These are solder paste inspection (SPI) post-solder deposition, automated optical inspection (AOI) post-placement, and AOI post-reflow. This requires a substantial investment; however, the combination of all three inspection machines is really the only true way to provide feedback for each stage of the manufacturing process.
Industry News | 2017-02-15 18:32:20.0
MIRTEC, “The Global Leader in Inspection Technology,” announces that it received the prestigious 2017 Service Excellence Award (SEA) from Circuits Assembly magazine in the Test and Inspection category. Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Feb. 14, 2017 ceremony that took place at the San Diego Convention Center.
Industry News | 2018-02-28 17:52:51.0
MIRTEC, “The Global Leader in Inspection Technology”, announces that it received the prestigious 2018 Service Excellence Award (SEA) from Circuits Assembly Magazine in the category of Test and Inspection. This is the fourth year in a row that MIRTEC has received this award for outstanding customer service! Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center.
Industry News | 2019-01-30 08:03:04.0
MIRTEC, “The Global Leader in Inspection Technology”, announces that it received the prestigious 2019 Service Excellence Award (SEA) from Circuits Assembly Magazine in the category of Test and Inspection. This is the fifth consecutive year that MIRTEC has received this award for outstanding customer service! Mike Buetow, Circuits Assembly’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center.
Industry News | 2020-02-06 04:17:15.0
MIRTEC is pleased to announce that it received the prestigious 2020 Service Excellence Award (SEA) from CIRCUITS ASSEMBLY magazine in the category of Test and Inspection. This is the sixth consecutive year that MIRTEC has received this award for outstanding customer service! Mike Buetow, CIRCUITS ASSEMBLY’s Editor-in-Chief, presented the award to Brian D’Amico, President of MIRTEC’s North American Sales and Service Division during a Tuesday, Feb. 4, 2020 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2003-04-30 08:37:19.0
Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Industry News | 2003-06-17 08:50:16.0
The CECC-approved DIN EN60603-2 (DIN41612) Series is ideal for electronics equipment requiring reliable yet inexpensive circuit board interconnection.
Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
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