Industry News | 2023-05-15 17:43:46.0
IPC and the Information Technology Industry Council (ITI) will host a virtual conference, "Critical and Emerging Environmental Product Requirements" on June 6 from 11:00 am to 3:30 pm EDT. The event will explore the latest environmental requirements that impact product design, manufacturing, supply chain management, and technology innovation.
Industry News | 2018-08-28 17:04:51.0
IPC – Association Connecting Electronics Industries® in partnership with Surface Mount Technology Association (SMTA) will host the High-Reliability Cleaning and Conformal Coating Conference, November 13–15, at the Chicago Marriott in Schaumburg, Ill. The 2018 conference will focus on electronics assembly and the influence of cleanliness and coating on producing reliable hardware.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2009-07-24 14:13:44.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the program for their co-organized 2009 Medical Electronics Symposium: Drivers for Technology, Health and the Economy on September 16-17, 2009 at Arizona State University, Tempe, AZ. This two day program will cover a broad spectrum of medical applications with Day 1 focusing primarily on the chip level component packaging and Day 2 focusing on board assembly and systems levels.
Industry News | 2022-12-26 11:44:31.0
The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.
Industry News | 2018-03-26 20:46:47.0
IPC’s statistical programs for the global assembly equipment and solder industries are now open to new participants for 2018. The deadline for IPC members to sign up is April 6. Participation is free to IPC-member companies as a benefit of membership.
Industry News | 2008-12-02 14:39:08.0
Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.
Industry News | 2008-12-06 02:26:28.0
Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.
Industry News | 2010-04-12 17:02:19.0
Minneapolis, MN - The SMTA proudly announces three upcoming offerings of SMT Processes Certification in Toronto, Minneapolis, and Cleveland. The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
