Electronics Forum | Mon Jul 07 11:46:29 EDT 2008 | aj
Hi All, Can anyone advise the spec for land size of a lead 0.2mm in width? I am placing a TQFP128 0.4mm pitch, the leads seem to be wider than the actual pads they are been placed on? I am also experiencing poor wetting on this part , it has NiPdAU
Electronics Forum | Wed Feb 04 08:28:07 EST 2009 | milroy
Hi, I have done conversion from SAC387 to SCS7 with great results on process improvement with low cost. I see only the melting point is higher but still the solder pot temperature settings is 250�C to 260�C as SAC. If somebody think the temperature
Electronics Forum | Fri Jan 18 12:34:14 EST 2013 | duchoang
Yes, I have. think I have pretty good reflow profile. We use Lead-Free,No-Clean,SAC305 Solder Paste. The problem is at LGA design.The pad size is alot bigger than BGA. They are totally flat and do not have balls/spheres which melted and collapsed thr
Electronics Forum | Sat Apr 05 13:04:33 EDT 2014 | horchak
237C max is on the low end for SAC305, especially if you have heavy leaded components. I always went with 245C and above depending on the board design. I noticed the electrolytic caps. You need to check max temp with the manufacture on those. When I
Electronics Forum | Fri Feb 15 15:37:35 EST 2019 | emeto
Hello, I have a capacitor that doesn't form intermetallic joint with SAC 305 solder paste.The board is ENIG. Solder melts and forms good intermetallic joint with the PCB finish. However, capacitor can be removed with physical force - it looks like a
Electronics Forum | Fri Apr 07 17:44:07 EDT 2006 | ratsalad
I still have half of a 500 g jar of this paste left. I'm going to give it another shot, but my first experience was not so wonderful. Everything was great until we reflowed it. Our profile matched AIM's recommendation, as far as I can see. The ch
Electronics Forum | Fri Nov 13 08:27:43 EST 2009 | herman
Your customer is very unreasonable to demand void-free BGA SJs. Minor voiding is not a condition for rejection per IPC-A-610D, J-STD-001D, or even J-STD-001DS (Space addendum). Having said that, let me tell you that the voiding has little or nothing
Electronics Forum | Wed May 10 00:27:46 EDT 2006 | Chris
Russ, By a longer profile you mean a more even slope across the entire profile. Unfortunately I only have a 5 zone oven that is fairly short. How many heated zones are you using? Did you shrink the 0402 pad design and leave less pad exposed out a
Electronics Forum | Thu Sep 23 11:56:30 EDT 2004 | rkevin
We are printing on an assembly using SAC305 Alloy Sn96.5 Ag 3 Cu .5 with a no clean flux and getting virtually NO spread with either a ramp to spike or straight ramp profile. We are printing to standard FR4 board with immersion Ag finish. I am trying
Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x
Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp
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