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MAPICS and Georgia Tech Lead Groundbreaking Advancements for Electronics Manufacturers

Industry News | 2003-03-19 08:25:45.0

Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Rogers Corporation Reports 50% Increase in Earnings

Industry News | 2003-04-25 08:11:22.0

Diluted earnings per share for the quarter were $0.36 compared to the $0.24 earned in last year�s first quarter.

SMTnet

Altium Unveils New �Board-on-Chip� Technology

Industry News | 2003-04-30 08:37:19.0

Altium to preview industry-first technology at Programmable World that allows engineers to use board-level methodologies to design and implement embedded systems on FPGAs

SMTnet

NEMI's Test Strategy Project Releases Cost Model

Industry News | 2003-05-22 08:54:17.0

Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies

SMTnet

MIRTEC to Exhibit Extensive Range of AOI, SPI, X-ray and Specialized LED Inspection Systems at IPC APEX 2012

Industry News | 2012-01-23 00:02:12.0

MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.

MIRTEC Corp

YXLON International and MIRTEC Announce Close Cooperation Empowering Industry 4.0 in the Electronics Production Market

Industry News | 2015-05-07 19:28:29.0

MIRTEC announce a new strategic cooperation that will empower yield improvement in the electronics manufacturing industry.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2016

Industry News | 2016-02-17 17:07:17.0

“The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1334 at the 2016 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place March 15-17, 2016 at the Las Vegas Convention Center.

MIRTEC Corp

Hot Off Record Breaking Q1, MIRTEC Europe to Exhibit at SMT/Hybrid/Packaging

Industry News | 2016-04-17 21:30:50.0

MIRTEC, “The Global Leader in Inspection Technology,” announced that MIRTEC Europe had a record breaking first quarter and has high expectations for the months to come. Also, MIRTEC will display its award-winning 3D AOI and SPI Inspection Systems in pc tec’s booth, Hall 7A, Stand 504, at the upcoming SMT/Hybrid/Packaging show, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

Industry News | 2017-01-11 18:22:38.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.

MIRTEC Corp


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