Electronics Forum | Wed Oct 17 02:53:36 EDT 2001 | dszeto
The fine pitch QFP is a 240 pin one being loaded with other components on a 2.0mm thick FR4 PCB. There are 6 of this Qfp's on this PCB showing the same charactristic of bowing therfore the solder fillets are vary from the center to the end of the pa
Electronics Forum | Fri Aug 02 11:38:14 EDT 2002 | Mike Konrad
Hi CarlN, I�m quite surprised that you viewed my response to your question as a �canned response�. I discussed transducer wattage, transducer amplitude, chemical selection (more than just ours) in an effort to assist your in adhesive removal issue.
Electronics Forum | Tue Mar 04 14:14:19 EST 2003 | moncav
In the spirit of the open forum, I would rather not advertise our product. However, if you would please contact me personally, I would be very happy to discuss bottomside support tooling with you. By watching the forum, we try to give educated, ge
Electronics Forum | Fri May 30 15:51:52 EDT 2003 | caldon
I am really reaching for the crack pipe now!! We recv'd a quote from a CM with a set-up charge and a Manufacturing charge. Is there a generic rule of thumb or ratio between Set-up and Manufacturing? One would think the manufacturing would be cheaper
Electronics Forum | Tue Apr 20 10:15:29 EDT 2004 | rob_thomas
Your question is way too generic.Your efficiency will depend on your line configration and the kind of product you are running, among other factors. Start by mapping your process and collect some data for a week.That should give a baseline to start
Electronics Forum | Tue Mar 22 06:03:55 EST 2005 | Base
Try the IPC-254x CAMX standards (webstds.ipc.org, no www prefix!). They define a set of generic and process-specific XML messages for equipment to send out all sorts of process-related events. I know there are standardized messages for print, dispens
Electronics Forum | Mon Jun 13 11:56:29 EDT 2005 | patrickbruneel
Hi All, There are IPC drafts in circulation IPC-1751, Generic Requirements for Declaration Process Management and IPC-1752, Materials Declaration Management. To me it looks like the regulations become more tolerable towards lead in solder Lead in s
Electronics Forum | Mon Jul 10 20:59:14 EDT 2006 | davef
Dave Try: * IPC-2221 - Generic Standard On Printed Board Design * IPC-2222 - Sectional Design Standard For Printed Board For Organic Printed Boards Our old [euphemistically] friend Earl Moon has written extensively on DFM. Look at his site: http://
Electronics Forum | Thu Jul 24 17:02:18 EDT 2008 | jlawson
OK , the H6H file is a binary structured file and can be read if you write a program in VB etc to extract the info you need, would take some time to sort out where to get what in the file, juki would no help you here.... Assuming you need placement
Electronics Forum | Thu May 14 13:25:14 EDT 2009 | cyber_wolf
Me thinks generic profile + desktop and laptop computer boards= not happy time. Attach thermo-couple to appropriate location on said part/pcb. Make profile same as solder manufacturer / component manufacturer spec. There is no magic heater set poin
