Industry Directory | Consultant / Service Provider / Training Provider
EDA Software vendor; PCB Training Provider
Industry Directory | Consultant / Service Provider / Manufacturer
TDM International is a supplier of expert GenRad 228x and Teradyne TestStation test engineering services and quality test fixtures.
Industry Directory | Manufacturer / Media / Publisher / Online Resource
Wenzhou Yingxing Technology Co., Ltd was established in 2009, which is a domestic R & D and manufacture of high-end SMT high-tech enterprise, is committed to developing technology-intensive automation
Through many years of close involvement with the Automotive EMC Directive, we have acquired an excellent understanding of the procedure and test requirements needed to comply with this directive. We have helped companies to successfully obtain necess
Technical Library | 2021-03-24 01:34:35.0
In this article we propose a generic test script for real=time embedded software system testing, which has been applied to ATE (Automated Test Equipment). After a summary of the theory about embedded software automated test based on test script, the design philosophy and implementation details are described. We have chosen an ATE and integrated python interpreter into it.
Used SMT Equipment | Pick and Place/Feeders
Mimot Advantage IIIS Machine plus 275 feeders, conveyors, etc. will sell all items separately Only feeders shown in photo but price includes complete system plus programming station and spares S/N11331-02 10/2001 208 VAC 3PH 3x10Amps 12,000 cph
Industry News | 2001-12-24 01:02:20.0
Cost-effective solution to automation of PCB assembly equipments and SMT production line
Used SMT Equipment | Pick and Place/Feeders
The Price is negotiable. The machine has a very good looking, as new Optimal placement rate: 6,800 cph / Tact time: 0.55 sec/chip with line camera - 0.9 sec/QFP with line camera - 2.3 sec/QFP with area CCD camera. Applicable components: 0201
Technical Library | 2017-05-04 17:35:01.0
Most of today's printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis, especially when a good accuracy is expected. Few base material suppliers' datasheet show X, Y and Z thermal conductivities. In most cases, a single value is given, moreover determined with a generic methodology, and not necessarily adapted to the reality of glass-reinforced composites with a strong anisotropy.After reminding of the fundamentals in thermal science, this paper gives an overview of the state-of the art in terms of thermal conductivity measurement on PCB base materials, and some typical values. It finally proposes an innovative method called transient fin method, and associated test sample, to perform reliable and consistent in plane thermal conductivity measurement on anisotropic PCB base materials.
Technical Library | 2023-09-18 14:10:01.0
As with many advancements in the electronics industry, consumer electronics is driving the trends for electronic packaging technologies toward reducing size and increasing functionality. Microelectronics meeting the technology needs for higher performance, reduced power consumption and size, and off the- shelf availability. Due to the breadth of work being performed in the area of microelectronics packaging/components, this report limits it presentation to board design, manufacturing, and processing parameters on assembly reliability for leadless (e.g., quad flat no-lead (QFN) or a generic term of bottom termination component (BTC)) packages. This style of package was selected for investigation because of its significant growth, lower cost, and improved functionality, especially for use in an RF application.
