Parts & Supplies | Other Equipment
The 901,904,925 ceramic nozzless are revolutionizing the pick and place industry by offering more efficiency and outlasting al The 901,904,925 ceramic nozzless are revolutionizing the pick and place industry by offering more efficiency and out
Waterjet allows for improved cutting tolerances, improved lead times and the ability to provide highly complex geometry. Using a stream of water with forces of 55,000 PSI yields fast production rates and tool free cutting. Our single head and 4-head
Parts & Supplies | Other Equipment
Siemens 901,904,925 nozzles/Yamaha 71A,72A,79A XP142,143/MV 0805/0603/0402 MSH2 0805/0603/0402 MSH3 0805/0603/0402 The new series of Siemens ESD ceramic replacement nozzles are revolutionizing the pick and place industry by offering more
Parts & Supplies | Other Equipment
Siemens 901,904,925 nozzles/Yamaha 71A,72A,79A XP142,143/MV 0805/0603/0402 MSH2 0805/0603/0402 MSH3 0805/0603/0402 The new series of Siemens ESD ceramic replacement nozzles are revolutionizing the pick and place industry by offering more
Parts & Supplies | Other Equipment
Siemens 901,904,925 nozzles/Yamaha 71A,72A,79A XP142,143/MV 0805/0603/0402 MSH2 0805/0603/0402 MSH3 0805/0603/0402 The new series of Siemens ESD ceramic replacement nozzles are revolutionizing the pick and place industry by offering more
Parts & Supplies | Assembly Accessories
Siemens 901,904,925 nozzles/Yamaha 71A,72A,79A XP142,143/MV 0805/0603/0402 MSH2 0805/0603/0402 MSH3 0805/0603/0402 The new series of Siemens ESD ceramic replacement nozzles are revolutionizing the pick and place industry by offering more
Used SMT Equipment | AOI / Automated Optical Inspection
Hello and thank you for your interest in our Orbotech Symbion S36 AOI For Sale. The system is Year 2006.... Excellent condition !!! Complete with all accessories and manuals. Symbion S36 Plus delivers top-of-the-line Post-Reflow AOI p
Technical Library | 2008-10-15 20:16:12.0
Solder paste dispensing is usually considered a slow process. Due to the speed advantages, screen printing is used to apply solder paste whenever possible. However, screen printing is not always an option. Leveraging the high speed of piezo drive technology opens the door to a broad range of solder paste dispensing applications. The ability to dispense dots under 300-μm diameter, even as small as 125 μm, enables BGA rework, small geometry deposits for miniaturized passive components, electrical connections in recessed cavities, and RF shield attach for handheld devices.
Industry Directory | Manufacturer
Depanelizer Equipment and Tools For Electronic Assembly. PCB Racks and Trays. Wire Crimp Press and Tooling.
Technical Library | 2019-05-23 10:30:22.0
Increasing I/O numbers, device complexity, and product miniaturization requires high precision bonding tools, and sophisticated equipment. Careful consideration should be given to wedge geometry while selecting the tool for a fine pitch wire bonding application. Wire bonding is a process that creates an electrical connection between a die and a substrate or lead typically using gold or aluminum wire. Wedge bonding is a specific type of wire bonding that uses a wedge shaped tool to create the welds. The design of the wedge tool has changed very little over the past decade. The wire is fed at an angle through the back of the wedge. This angle is typically 30 to 60 degrees and is application dependent. Some applications require a higher feed angle due to package clearance issues. Some deep access applications require a 90 degree feed angle. In this configuration, the wire is fed through a hole in the shank of the wedge tool. Wire feed is shown in Figure 1.
