Industry News | 2019-09-13 07:56:55.0
Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.
Industry News | 2010-07-12 15:41:25.0
The safe and proper control of electrostatic discharge (ESD) is one of the most critical challenges facing the electronics industry today. To address this vital concern, IPC — Association Connecting Electronics Industries® and the Electrostatic Discharge Association (ESDA) released a new ESD training video, DVD-74C, ESD Control for Electronics Assembly.
Industry News | 2011-02-07 15:28:03.0
Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for 0201 and 01005 Micro-Components. By working closely with a component manufacturer and leading EMS companies, Count On Tools guarantees secure picking of all fragile micro-components and accurate placement on the circuit board.
Industry News | 2017-10-05 05:56:21.0
The SMTA Capital Chapter is pleased to announce its third meeting of 2017 on November 7th, scheduled from 5:30 pm to 8:00 pm at ZESTRON Americas, 11285 Assett Loop, Manassas, VA, 20109. Ravi Parthasarathy, Senior Application Engineer, ZESTRON Americas, will present “Cleaning Before Conformal Coating” and “pH Neutral Cleaning Agents - Market Expectation and Field Performance”.
Industry News | 2022-05-05 17:28:46.0
Includes new, easy-to-operate pail pump with unique pail change and loading method, which also reduces material waste
Industry News | 2010-04-10 02:09:54.0
If a picture is worth a thousand words, the new H revision of IPC-A-600, Acceptability of Printed Boards, is a priceless work of art for fabricators and assemblers, particularly inspectors and product developers. IPC — Association Connecting Electronics Industries® announces the new releases of IPC-A-600H and its companion document the C revision of IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.
Hi-Q Materials provides prototypw, quickturn substrates with fine line geometry. Also sell equipment for substrate fab using photoimagable technology. R&D in advanced packaging materials.
Industry Directory | Manufacturer
CVInc services advanced packaging. Placing solder bumps on single die, partial wafers, and complete wafers...we also offer RDL (redistribution) services in 5-7 working days. Our custom preforms are as small as 50um geometries.
Used SMT Equipment | In-Circuit Testers
Differential Probe 3.5Ghz Tektronix proven expertise in probes brings you the highest fidelity in high-speed differential probing. The P7330 and P6330 high-bandwidth differential probes offer excellent signal fidelity, meeting the needs of engineer
Used SMT Equipment | In-Circuit Testers
Tektronix P6246 Active Probe 400MHz The P6248, P6247 and P6246 enable users to make time domain or frequency domain measurements on high bandwidth signals commonly found in disk drive, digital IC design (RAMBUS) and communication applications (G
