KSMART Warp for Koh Young Technology’s 3D SPI automatically compensates for PCB warp in real time during inspection, using CAD information or learned PCB geometry prior to inspection. The KSMART Warp functionality for 3D SPI systems now applies to a
Used SMT Equipment | In-Circuit Testers
Tektronix P7330 Differential Probe 3.5Ghz Tektronix proven expertise in probes brings you the highest fidelity in high-speed differential probing. The P7330 and P6330 high-bandwidth differential probes offer excellent signal fidelity, meeting t
Used SMT Equipment | In-Circuit Testers
Tektronix P7330 Differential Probe 3.5Ghz Tektronix proven expertise in probes brings you the highest fidelity in high-speed differential probing. The P7330 and P6330 high-bandwidth differential probes offer excellent signal fidelity, meeting t
Used SMT Equipment | Semiconductor & Solar
Bondtester by DAGE, in good condition. DAGE Series 4000 Bondtester product information. The 4000 bondtester is multipurpose, capable of performing all pull and shear applications. The 4000 bondtester can be configured as a simple bond wire pull
1.jpg)
New Equipment | Industrial Automation
Contact: Nancy Lin Email:info@amikon.cn Skype:onlywnn_1 Telegram:+8618020776786 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 Control Systems (DCS, PLC/SPS, CNC) - Panel Controllers - HMI and Display Panels - Industrial PC’s - Dri
Trims webs cleanly and without burrs. Custom blade geometry for clean shear. Unique, smooth blade motion rocks forward to avoid shock. Standard blade thicknesses: .090" & .100". (Custom sizes available) Change blade sizes in less t
Technical Library | 2011-04-14 15:29:39.0
Multilayer Ceramic Capacitors (MLCC) come in a broad range of sizes, geometries, and values, offering design engineers with many options for designing circuits. In many cases these MLCC’s offer advantages over other types of capacitors including low ESR/E
Technical Library | 2011-06-09 13:29:17.0
Flatness measurement of electronic parts and assemblies, or PCB’s, has become increasingly critical as geometries become smaller: finer pitches, smaller solder ball volumes, thinner substrates, etc. Additionally, processing temperatures vary and can pla
Industry Directory | Manufacturer
Pioneers in the area of solderless assembly technology and originators of the OCCAM process. Developing IP for next and future generations of high reliability and better performing electronic products.
Technical Library | 2019-01-02 21:51:49.0
Failed solder joints remain a constant source of printed circuit board failure. Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery, flux chemistry, and solder chemistry creates the solder bond or joint. Today, reliability relies on visual inspection; operator experience and skill, control of influencers e.g. tip geometry, tip temperature, and collection and analysis of process data. Each factor involved with the formation of the solder joint is an element of risk and can affect either throughput or repeatability. Mitigating this risk in hand soldering requires the identification of these factors and a means to address them.
