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Challenges for Step Stencils with Design Guidelines for Solder Paste Printing

Technical Library | 2015-08-25 13:51:27.0

The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil. The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process.

LaserJob

Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)

Technical Library | 2017-06-15 00:44:19.0

Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively inspecting underfill layers connecting organic interposers sandwiched between two ceramics substrates.First, we inspected the samples with transmission mode of scanning acoustic tomography (SAT) system, an inspection routine usually employed in assembly lines because of its simpler interpretation criteria: flawed region blocks the acoustic wave and appears darker. In this multilayer sample, this approach does not offer the crucial information at which layer of underfill has flaws. To resolve this issue, we use C-Mode Scanning in reflection mode to image layer by layer utilizing ultrasound frequencies from 15MHz to 120MHz. Although the sample is thick and contains at least 5 internal material interfaces, we are able to identify defective underfill layer interfaces.

Flex (Flextronics International)

Alpha® Selects YAMAHA YCP10 High-Performance Compact Printer for Key Laboratory Facility

Industry News | 2016-01-12 01:45:47.0

Yamaha Motor IM announced today that Alpha ('Alpha Metals') has chosen the YAMAHA YCP10 High-Performance Compact Printer for purchase and installation at a key laboratory facility in New Jersey. After rigorous print testing, the YCP10 demonstrated the ability to deliver the consistent printing results that the Alpha evaluators were seeking.

Yamaha Motor IM America, Inc.

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New Equipment | Industrial Automation

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