Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
If you have any inquiry, just feel free to contact bella@qy-smt.com. Compatible Strip Board such as Glass fiber board, aluminum board, etc
Offline Dual Table PCB Depaneling Router Machine with SycoTec Spindle 4025HY PCB Depaneling Router Features: 1. Two-slide PCB Separator 2. Low stress 3. Sharp cutting edge 4. Manul loading /unloading 5. High speed cutting by 4 axes control(XY
Events Calendar | Tue Mar 30 00:00:00 EDT 2021 - Tue Mar 30 00:00:00 EDT 2021 | ,
Juarez Chapter Webinar: DFM, Design For Manufacturing
Industry News | 2009-11-12 15:41:02.0
XDry Celebrates a Successfull Productronica
Industry News | 2022-10-06 18:05:48.0
IPC announces the first employee of its new legal entity in Germany, Hans-Peter Tranitz, Ph.D. Dr. Tranitz will serve as senior director, Solutions, at IPC Electronics Europe GmbH in Munich. In this role, Dr. Tranitz will focus on IPC global initiatives including automotive electronics, advanced packaging, and Factory of the Future as well as serving as a technical resource for regional activities in Europe.
Events Calendar | Tue Oct 15 00:00:00 EDT 2024 - Thu Oct 17 00:00:00 EDT 2024 | ,
GfKOOR Series | Seminar Application and Utilisation of Protective Coatings for Electronic Assemblies
Industry News | 2015-09-16 10:52:46.0
IPC — Association Connecting Electronics Industries® will host this year’s Europe Forum: Innovation for Reliability in October in Essen, Germany. This three day event consists of two parts. The 9th Annual CALCE Tin Whiskers Symposium on 13 October, followed by the Technical Conference: Innovation for Reliability on 14-15 October.
Industry News | 2017-05-15 15:35:16.0
IPC will host Reliability Forum: Emerging Technologies from June 27-28 in Düsseldorf, Germany. This two-day event will address building reliability into electronic products utilizing newer technologies and processes in every phase of the product launch cycle.
