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Yamaha HEAD SERVO BRD ASSY

Yamaha HEAD SERVO BRD ASSY

Parts & Supplies | Pick and Place/Feeders

KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw  YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl

Qinyi Electronics Co.,Ltd

Submicron semi-automatic flip eutectic placement machine flip eutectic placement machine

Industry News | 2019-12-16 22:42:05.0

T1 is a multi-function placement machine, also a submicron flip eutectic placement machine, providing placement accuracy up to 5 microns, suitable for all kinds of flip chip, common chip mounting, can handle the minimum chip spacing as low as 50 microns.

Beijing Technology Company

FINEPLACER® femto2  - Automated Sub-Micron Die Bonder

FINEPLACER® femto2 - Automated Sub-Micron Die Bonder

New Equipment | IC Packaging

Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte

Finetech

FINEPLACER lambda - Flexible Sub-micron Die Bonder

FINEPLACER lambda - Flexible Sub-micron Die Bonder

New Equipment | IC Packaging

The FINEPLACER® lambda is a flexible sub-micron bonder used for precise placement, die attach and advanced packaging. The system offers outstanding flexibility with a modular design and can be easily reconfigured for different applications. The syst

Finetech

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies.

Videos

The FINEPLACER® Lambda, a modularly designed bonder, provides a full range of process capabilities and multiple bonding technologies. Read more: http://eu.finetech.de/micro-assembly/products/fineplacerr-lambda.html

Finetech

Re: BAS32 diode broken

Electronics Forum | Wed Jan 26 07:55:17 EST 2000 | Dave F

Mikel: There's a lot of ways to break a glass diode. Poor material handling High placement force Thermal stress Board flex So, where is this damage occuring? Dave F

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 11:36:37 EDT 1999 | Jimmy G

| | | | Hello everyone, | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in advanc

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Tue Aug 24 15:10:14 EDT 1999 | Ian T

| | | | | Hello everyone, | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks in ad

Re: Cylindrical diodes Missing during SMT process.

Electronics Forum | Wed Aug 25 01:25:49 EDT 1999 | Gyver

| | | | | | Hello everyone, | | | | | | We found many cylindrical diodes missing during SMT process. Could someone tell us how to prevent this problem? Is it effective to change the shape of stencil apture or reduce fan speed in reflow oven? Thanks i

MyData Missing Placements

Electronics Forum | Wed Jul 11 06:10:17 EDT 2007 | chrispy1963

I have read through the solutions the other techs have mentioned, however, I have a couple more thoughts to offer you when you have these kinds of problems. 1) If you are using a C14 tool it is a spring tool and thereby it utilizes the "Force Sensor

Sm t t net
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