EMST Stallion PLC TT-JW is a new table top wave soldering machine from EMS Technologies, the soldering specialists. After the world wide success of the previous table top model, EMST Stallion, it is upgraded from manual controls to PLC based control
New Equipment | Wave Soldering
EMST Stallion PLC TT-JW is a new table top wave soldering machine from EMS Technologies, the soldering specialists. After the world wide success of the previous table top model, EMST Stallion, it is upgraded from manual controls to PLC based control
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Sheet Durostone antistatic for wave pallets Description: Sheet Durostone antistatic is glass reinforced epoxy, which is made from composite material and reinforced fiberglass. Overview: 1, The product uses a high performance glass-filler for
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New Equipment | Board Handling - Pallets,Carriers,Fixtures
CDM Durapol laminate 68910 for SMT solder carrier Overview: 1, CDM Durapol laminate 68910 is reinforced glass fibre composite. It have been proved to be suitable for all processes during PCB assembly such as SMT reflow and wave soldering processes.
New Equipment | Wave Soldering
PCB Pallet Material, Ricocel ES-3261A Sheet in Black Color Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fi
Technical Library | 2021-09-29 13:35:21.0
In PCB circuit assemblies the trend is moving to more SMD components with finer pitch connections. The majority of the assemblies still have a small amount of through hole (THT) components. Some of them can't withstand high reflow temperatures, while others are there because of their mechanical robustness. In automotive applications these THT components are also present. Many products for cars, including steering units, radio and navigation, and air compressors also use THT technology to connect board-to-board, PCB's to metal shields or housings out of plastic or even aluminium. This is not a simple 2D plain soldering technology, as it requires handling, efficient thermal heating and handling of heavy (up to 10 kg) parts. Soldering technology becomes more 3D where connections have to be made on different levels. For this technology robots using solder wire fail because of the spattering of the flux in the wires and the long cycle time. In wave soldering using pallets the wave height is limited and pin in paste reflow is only a 2D application with space limitations. Selective soldering using dedicated plates with nozzles on the solder area is the preferred way to make these connections. All joints can be soldered in one dip resulting in short cycle times. Additional soldering on a small select nozzle can make the system even more flexible. The soldering can only be successful when there is enough thermal heat in the assembly before the solder touches the board. A forced convection preheat is a must for many applications to bring enough heat into the metal and board materials. The challenge in a dip soldering process is to get a sufficient hole fill without bridging and minimize the number of solder balls. A new cover was designed to improve the nitrogen environment. Reducing oxygen levels benefits the wetting, but increases the risk for solder balling. Previous investigations showed that solder balling can be minimized by selecting proper materials for solder resist and flux.
The following video guides the user through a typical data collection process. These steps may vary depending on the process your company uses. Categories: WaveRIDER, WaveRIDER SPC (v5.2x)
Industry News | 2010-10-07 14:49:04.0
A recently placed purchase order by the renowned Brazilian CERTI-Institute brought smiles on the faces of management and employees of ERSA. After successfully concluding the negotiations with the management of CERTI, ERSA was awarded a contract for delivery of production machinery and other equipment for the electronic production, valuing approximately 1, 2 Million €.
