Full Site - : glue procedure (Page 2 of 4)

SMT before through-hole

Electronics Forum | Tue Aug 14 10:51:18 EDT 2007 | erhard

standard procedure for this would be to solder SMDs on the bottom side and the LEDs all at once on the wave - if the layout is ok for the wave. You would have to glue the SMD components, for this you would have to use a glue dispenser or a special hi

Epoxy on bottom of SMT component

Electronics Forum | Tue Nov 27 20:05:31 EST 2007 | shy

Dback, Current method is by using dispenser machine to dispense the glue at PCB. This non-wetting is randomly and not repeating to the same location. My adhesive height is 0.01" to 0.035". Is this will cause the component to had a gap between the t

Re: SOLVENT/PROCEDURE TO REMOVE CURED EPOXY ON SMT COMPONENTS

Electronics Forum | Wed Oct 21 14:28:17 EDT 1998 | Earl Moon

| I'M LOOKING FOR A SOLVENT TO MAKE REMOVING EPOXY FROM THE BOTTOMSIDE OF BOARD ON SMT COMPONENTS. THIS IS MOST IMPORTANT AFTER THE EPOXY HAS CURED AND EVEN RAN THROUGH THE WAVE. I'M LOOKING FOR A WAY OF | MAKING THE REWORK PROCESS ON THE CURED EPOX

SMT Production

Electronics Forum | Mon Apr 22 23:51:06 EDT 2002 | mkkrishnakumar

Dear sir, I am a regular viewer of smtnet.com and now one of my customer have the process problem that is they are having double sided smd's and pth too. hence we have suggested them to do the following processes First do the smd soldering by ste

Juki KE-750 T & Z servo failures

Electronics Forum | Fri Aug 30 15:44:51 EDT 2019 | valentink

I will try outline Theta and Z-axis servo issues, we were facing last time. Story behind. Our 750 is used seldom and last time after switching it on initialization procedure ends with T axis of right head: Servo alarm. Opening front cover of 750 two

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