Electronics Forum | Wed Jul 31 10:03:44 EDT 2002 | gdstanton
Todd, Slim KIC 2000 would be my choice. We traded our Gold M.O.L.E for it and are very happy with the performance. The optimization program is great. No more guessing. The only thing I could gripe about is that it sucks up 9V batteries pretty quic
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Fri Sep 11 14:45:03 EDT 1998 | Earl Moon
| | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because t
Electronics Forum | Mon Oct 04 11:28:46 EDT 1999 | Mark D.
Does anyone have a list of component types that can be put on the bottomside of a doublesided reflow board that will not fall off during the second pass (Or on the otherhand, a list of components that will fall off)? This would be a list of parts tha
Electronics Forum | Mon Oct 04 11:23:55 EDT 1999 | Mark D.
Does anyone have a list of component types that can be put on the bottomside of a doublesided reflow board that will not fall off during the second pass (Or on the otherhand, a list of components that will fall off)? This would be a list of parts tha
Electronics Forum | Thu Nov 01 04:32:52 EST 2001 | wbu
Jonathan, we do that all day. We do not use different pastes nor do we glue components nor do we run different profiles. Depends on what is meant by "small components". In our case it�s all that "bird seed" up to SO8. That will work for more parts.
Electronics Forum | Fri Jul 10 14:40:12 EDT 1998 | Bob Willis
Yes this can be a killer. Its caused by glues with a high water content or fast curing of glues. When you get solder going through the glue it is litterally sucked in during solder wave contact. If you have never seen it you would never believe it bu
Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell
| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus
Electronics Forum | Tue Dec 04 10:30:16 EST 2007 | slthomas
Q: The question I have is do they wet in wave solder, and if they do, why does it matter what happens to them in reflow? A: Yes, but somebody here don't agree with me that the glued part need help from wave to get the good wetting. They are wrong
Electronics Forum | Wed Oct 06 11:58:33 EDT 1999 | Wolfgang Busko
| | | I hope that someone can help me with my problem! I am experiencing a lot of glued on parts falling off in the wave solder machine. A little information about my process: 1)We use Loctite 3609 glue that is used up long before its shelf life 2)
