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Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Industry News | 2023-01-23 18:38:38.0

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus

Heraeus Electronics showcases new portfolio for next-generation power electronics and semiconductor advanced packaging at SEMICON Korea 2023

Industry News | 2023-01-30 16:56:37.0

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus

Vision Engineering’s FREE Electronics Academy Webinar Series to Broadcast: Eliminate Printed Circuit Board Problems and Failure Modes

Industry News | 2018-01-16 11:59:10.0

Vision Engineering has teamed up with industry-expert Bob Willis to broadcast a free Electronics Academy Webinar aimed at identifying the issues affecting PCB/SMT assembly and the challenges of achieving Zero Defect Manufacture. The next webinar, Eliminate Printed Circuit Board Problems & Failure Modes will take place on January 23rd at 2:30 EST.

Vision Engineering Inc.

Use of Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics

Industry News | 2010-02-19 09:45:37.0

Pressurex® Sensor Film Needed to Measure Contact Pressure In Ultrasonic Welding

Sensor Products Inc.

Hesse & Knipps To Discuss "Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications" at SMTA Philadelphia Chapter Meeting

Industry News | 2012-05-30 13:50:20.0

Hesse & Knipps GmbH will discuss “Wedge Bonding for Chip-On-Board and Direct-Chip-Attach Applications” at the SMTA Philadelphia Chapter Meeting.

Hesse Mechatronics

StratEdge Features Packages for the Extreme Demands of GaN and GaAs Devices at IMS2018 in Booth 1649

Industry News | 2018-06-04 18:18:26.0

StratEdge Corporation will feature its new line of packages that meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices at the 2018 International Microwave Symposium. StratEdge packages meet the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.

StratEdge Corporation

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Industry News | 2012-08-14 10:24:59.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has appointed CWI Technical Sales as its representative along the United States East Coast (states of CT, MA, RI, VT, ME, NH, NY, NJ, DE, MD, PA, WV, VA, NC, SC, GA and FL) as well as the Canadian provinces of Quebec and Ontario

Hesse Mechatronics

AdoptSMT will show many new product and service offerings at the Southern Manufacturing Show Farnborough, February 2015, Booth L74

Industry News | 2015-01-08 14:04:52.0

At Southern Manufacturing 2014 AdoptSMT UK Ltd., member of AdoptSMT Group, will again present many new products for the European PCB Assembly Industry. The supplies, services and consultancy offered by AdoptSMT Group are focused around the aim to keep the customers production running. The main process supported by AdoptSMT with consumables, spares, service and pre-owned equipment is the automatic PCB Assembly including stencil printing, reflow soldering and AOI.

AdoptSMT Europe GmbH


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