Full Site - : gold and discoloration (Page 15 of 27)

AdoptSMT will show many new product and service offerings at the Southern Manufacturing Show Farnborough, February 2015, Booth L74

Industry News | 2015-01-08 14:04:52.0

At Southern Manufacturing 2014 AdoptSMT UK Ltd., member of AdoptSMT Group, will again present many new products for the European PCB Assembly Industry. The supplies, services and consultancy offered by AdoptSMT Group are focused around the aim to keep the customers production running. The main process supported by AdoptSMT with consumables, spares, service and pre-owned equipment is the automatic PCB Assembly including stencil printing, reflow soldering and AOI.

AdoptSMT Europe GmbH

Gen3 Systems will present the NEW, Award-Winning CM Series and AutoSIR/CAF 2 test systems at IPC APEX 2017

Industry News | 2017-01-09 19:39:50.0

Gen3 Systems Limited will exhibit in Booth #3136 with Ascentech, LLC at the 2017 IPC APEX EXPO, scheduled to take place Feb. 14-16, 2017 at the San Diego Convention Center in California. Gen3 and Ascentech will demonstrate the new CM+ Series and AutoSIR 2/AutoCAF 2.  

Gen3 Systems

Siborg Offering Discount on all Devices including LCR-meters for Students and Educators Until the End of August

Industry News | 2017-04-07 15:01:40.0

Students, educators and institutes will get a discount on devices and accessories in the LCR-Reader Store. The discount will reflect the quantity purchased

Siborg Systems Inc

ECD to Display Complete Range of Thermal Profiling and Verification Solutions, Introduce Breakthrough Oven Process Monitoring Technology at Productronica 2017

Industry News | 2017-10-31 18:46:42.0

At this year’s Productronica event in Munich, Germany, ECD (Hall A4, Booth 532) will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E.® thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization

Electronic Controls Design Inc. (ECD)

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

AdoptSMT will show many new product and service offerings at the Southern Manufacturing Show Farnborough, February 2014, Booth J45

Industry News | 2014-01-24 16:51:33.0

At Southern Manufacturing 2014 AdoptSMT UK Ltd., member of AdoptSMT Group, will again present many new products for the European PCB Assembly Industry. The supplies, services and consultancy offered by AdoptSMT Group are focused around the aim to keep the customers production running.

AdoptSMT Europe GmbH

AIM’s International Technical Support Manager, Carlos Tafoya, to present at the IPC Conference on Solder and Reliability in Costa Mesa, CA, November 13, 2013

Industry News | 2013-11-08 18:26:23.0

AIM Solder announces today that Carlos Tafoya, International Technical Application Manager, is to present "Alternative Lead-Free Alloys for SMT Assembly" at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, held November 13-14th, 2013 in Costa Mesa, CA. The presentation is scheduled on Wednesday, November 13 at 3:00 pm.

AIM Solder

Hesse & Knipps To Discuss “Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications” at IMAPS Advanced Technology Workshop

Industry News | 2012-05-11 20:19:04.0

Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.

Hesse Mechatronics

Nordson MARCH Research Evaluates the Effects of RF Plasma Processing Prior to Conformal Coating on Adhesion, Conformity of Coverage, and Electrical Functionality

Industry News | 2016-03-03 08:27:28.0

Nordson MARCH has recently released a white paper showing the results of RF plasma processing on conformal coating adhesion, the conformity of the coating coverage, and the resulting effects on electrical functionality of a fully assembled printed circuit board. The research was done in conjunction with Nordson ASYMTEK, AirBorn Electronics, and SMART Microsystems (formerly known as Desich SMART Center). The paper can be downloaded at http://bit.ly/MARCH-PlasmaWP.

MARCH Products | Nordson Electronics Solutions

PDR to demo entry level and advanced rework stations for SMD / BGA / microBGA / CSP / LED applications at SMTAI

Industry News | 2018-09-18 20:27:42.0

PDR today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will have the IR-C3 Chipmate Entry-Level SMD/BGA Rework Station and IR-E3 Evolution Series SMD/BGA IR Rework Station in Booth #527.

PDR-America


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