Electronics Forum | Mon Jan 07 13:18:28 EST 2002 | mregalia
I work for a microwave company. On our lower frequency boards (
Electronics Forum | Wed Jan 09 15:24:49 EST 2002 | mregalia
Thanks Chris. As I was writing my last message our mailperson dropped off the latest issue of Circuit Assembly. It has an article on mixing SMT and COB on the same board. The author recommends as a compromise 10-20 micro inches of gold over 70-100 of
Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia
Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board
Electronics Forum | Wed Jan 09 17:03:44 EST 2002 | rob_thomas
We follow IPC-2221 recommendations for Au and don't have a problem as long as the Ni is under 150 microinches.This ensures a consistent process for us.Also we do plasma clean after SMt and prior to wirebond.That makes a big difference. Rob
Electronics Forum | Wed Jan 09 12:20:00 EST 2002 | mregalia
Thanks for cluing me into IPC-2221. Though the numbers they give seem to contradict what I have learned from people working with the materials. At least I now know where the guideline for a max of 30 microinches of gold for soldering comes from. But
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Sat Oct 24 07:55:55 EDT 1998 | Chuck Garth
I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility getingthe heat seal ribbon to make consistant electrical contact. Any help would
Electronics Forum | Fri Oct 29 10:02:28 EDT 1999 | John Thorup
Chris A lot of people have reported sudden, fab lot related problems with Ni/Au pads. These are usually characterized by a discoloration of the gold and called cheerful names like "black pad disease". This can be a process problem at your fab house
Electronics Forum | Tue Oct 27 10:40:32 EST 1998 | Greg Curler
| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help
Electronics Forum | Sat Oct 24 23:30:59 EDT 1998 | Pete Sorenson
| I know that this not surface mount, but many of us have to perform multipule duties. Can anyone give me some information on this I am having problems getting relibility | getingthe heat seal ribbon to make consistant electrical contact. | Any help
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