Electronics Forum | Thu Aug 13 03:10:22 EDT 1998 | Terry Keen
| Couple of questions. | 1) Are we talking alumina substrates as the ceramic material? | 2) Are we co-firing gold as the conductors on the substrate surface? | 3) In other words, is this a hybrid thick film circuit? | 4) If so, how large or small? S
Electronics Forum | Wed Aug 12 13:11:37 EDT 1998 | Tyler Posey
| Can someone point me to where I can get a copy of the spec for these | finishes. | Thanks | Richard Jackson | richardj@tanisys.com | Jackson_Richard@csi.com Richard We have also been looking into OSP's. Enthone-OMI is a source for anything you ne
Electronics Forum | Wed Aug 12 07:31:37 EDT 1998 | Earl Moon
| We are taking enquiries for sub-contract work that we hope to be doing by Christmas. One of the enquiries is to assemble chip capacitors and an SO14 onto ceramic. Does the printing process, paste used and reflow process remain the same, or are ther
Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny
When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b
Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker
Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a
Electronics Forum | Tue Apr 11 20:26:16 EDT 2000 | Dave F
Jeremy: Parts assembler make leads of either Alloy 42 (Invar, whatever) or copper. The solderability of these leads are protected with eutectic or non-eutectic tin/lead solder, palladium or some palladium alloy, or gold. Cuppla things to consider:
Electronics Forum | Wed Apr 13 13:40:27 EDT 2011 | jebs
Hi. the res/cap is mostly 805, solder paste will be led free and will only have a few fine pitch IC on each board. The boards will contain between 140 - 160 components and will run a production of 300 - 500 each day with only one or two different boa
Electronics Forum | Thu Aug 31 18:59:55 EDT 2000 | Brian W.
Our customers use OSP, HASL, immersion tin and immersion gold as board finishes. If I recommend a finish to the customer, it is one of the immersion finishes or OSP. Those finishes have the advantage of a flat surface to deposit paste. HASL has va
Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com
| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f
