Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon
You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to
Electronics Forum | Fri Aug 07 07:44:56 EDT 1998 | Earl Moon
| | | No sour grapes, | | | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely
Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric
Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.
Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef
"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make
Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe
Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.
Electronics Forum | Fri Sep 08 04:45:17 EDT 2000 | PeterB
As per Travis's reply it could be something other than the reflow process. Another good one is if the printed PCB's have been cleaned down due to print misregistration etc.. If not properly controlled paste residues can remain distributed about the p
Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo
Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof
