Electronics Forum: gold embrittlement (98)

gold embrittlement on paste in hole 30 micro in. gold plated lead

Electronics Forum | Fri May 28 17:30:35 EDT 1999 | Dave Clements

I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is about

Re: gold embrittlement on paste in hole 30 micro in. gold plated lead

Electronics Forum | Fri May 28 17:44:51 EDT 1999 | Glenn Robertson

| I discovered that we have some gold plated (30 mico in.) through hole connectors which were Paste In Hole soldered (60 sec at reflow) on a HASL PCB. Do we have an embrittlement reliability issue? The calculated volume % of gold in the joints is abo

Industry News: gold embrittlement (2)

Hentec Industries/RPS Publishes an Engineer's Guide to Component Re-Conditioning Process

Industry News | 2021-04-13 17:37:07.0

Gold plating dissolves rapidly during soldering and can result in gold embrittlement. This tech paper examines how to re-condition electronic components prior to soldering.

Hentec Industries, Inc. (RPS Automation)

Hentec Industries/RPS Publishes Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Industry News | 2021-07-26 17:33:25.0

High thermal mass and fine-pitch components place increased demand on the selective soldering process. This tech paper outlines techniques that minizine these demands.

Hentec Industries, Inc. (RPS Automation)

Technical Library: gold embrittlement (3)

Gold Embrittlement In Lead-Free Solder.

Technical Library | 2014-08-07 15:13:44.0

Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.

DfR Solutions (acquired by ANSYS Inc)

Techniques for Selective Soldering High Thermal Mass and Fine-Pitch Components

Technical Library | 2022-08-08 15:06:06.0

Selective soldering has evolved to become a standard production process within the electronics assembly industry, and now accommodates a wide variety of through-hole component formats in numerous applications. Most through-hole components can be easily soldered with the selective soldering process without difficulty however some types of challenging components require additional attention to ensure that optimum quality is maintained. Several high thermal mass components can place demands on the selective soldering process, while the use of specialized solder fixtures, or solder pallets, often places additional thermal demand on the preheating process. Fine-pitch through-hole components and connectors place a different set of demands on the selective soldering process and typically require special attention to lead projection and traverse speed to minimize bridging between adjacent pins. Dual in-line memory module (DIMM) connectors, compact peripheral component interface (cPCI) connectors, coax connectors and other high thermal mass components as well as fine-pitch microconnectors, can present challenges when soldered into backplanes or multilayer printed circuit board assemblies. Adding to this challenge, compact peripheral component interface connectors can present additional solderability issues because of their beryllium copper base metal pins. Key Terms: Selective soldering, drop-jet fluxing, sustained preheating, flux migration, adjacent clearance, lead-to-hole aspect ratio, lead projection, thermal reliefs, gold embrittlement, solderability testing.

Hentec Industries, Inc. (RPS Automation)

Videos: gold embrittlement (1)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

Express Newsletter: gold embrittlement (84)

SMTnet Express - August 7, 2014

SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk

Partner Websites: gold embrittlement (15)

Dissolution Rate of Specific Elements in SAC305 Solder

Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5255

) when the solder gold content exceeds 5% by weight. Controlling the component gold plating thickness as well as the soldering process temperature and time can prevent gold embrittlement

Surface Mount Technology Association (SMTA)


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