Full Site - : gold embrittlement lead-free (Page 2 of 44)

New Requirements To Identify Conflict Minerals Will Impact Entire Electronics Industry Supply Chain

Industry News | 2010-09-20 20:34:52.0

The U.S. Securities and Exchange Commission (SEC) is drafting new reporting requirements on the use of conflict minerals. “These new reporting requirements could have a significant impact on the entire electronics industry supply chain, much like the lead-free requirements of RoHS,” according to Mikel Williams, chairman of the IPC Government Relations Committee and president and CEO of DDi Corp.

Association Connecting Electronics Industries (IPC)

Seven IPC APEX EXPO™ Technical Conference Sessions Go Global - Live From Las Vegas

Industry News | 2011-01-20 13:45:14.0

IPC will introduce a cyber conference at IPC APEX EXPO in Las Vegas in 2011. The IPC APEX EXPO Cyber Conference will feature live broadcasts and post-show archives of seven of the show's thirty-five technical conference sessions on April 12–14, 2011.

Association Connecting Electronics Industries (IPC)

IPC Delivers New Standard on Handling, Packaging and Storage of Printed Boards

Industry News | 2010-09-13 15:36:15.0

IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.

Association Connecting Electronics Industries (IPC)

Conflict Metals: Good Intentions Gone Tragically Bad

Industry News | 2011-05-23 15:41:12.0

It's a script straight out of the movies. Just replace "blood diamonds" with "blood metals" and begin with a scene that demonstrates the tens of millions of dollars in profit flowing into rebel mines in the Democratic Republic of the Congo (DRC), funding criminal networks and perpetrating horrific war crimes. In the movie, the U.S. government comes to the rescue by implementing a law that withholds resources from these groups, breaks the rebel mines and ends the atrocities.

Association Connecting Electronics Industries (IPC)

IPC Volunteers Honored for Contributions to Electronics Industry at IPC APEX EXPO

Industry News | 2016-03-22 16:48:06.0

IPC – Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the Las Vegas Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.

Association Connecting Electronics Industries (IPC)

Immersion gold VS Plating gold

Industry News | 2019-05-16 01:27:23.0

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.

Headpcb

Metcal customers go for gold with proven solder Technologies

Industry News | 2008-12-02 16:49:28.0

OK International has long been driving productivity for its customers, as a young engineer recently found out when the Metcal MX-500S Soldering and Rework System helped him to gold medal position at the World Skills Competition. OK International has now extended the proven capabilities of this product even further with the launch of the highly anticipated MX-5000 Soldering, Desoldering and Rework System.

OK International

Immersion gold VS Plating gold

Videos

There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious tr

Headpcb

Gold Embrittlement In Lead-Free Solder.

Technical Library | 2014-08-07 15:13:44.0

Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.

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