Electronics Forum | Wed Sep 18 22:10:48 EDT 2002 | Joe Wong
I'm working China ,in my working factory is a electronic OEM factory and got COB and SMT. But recently, COB got a big problem because the PCB gold finger got a contamination, that make us got a most defect product. So anyone can answer me how to clea
Electronics Forum | Thu Sep 19 20:28:59 EDT 2002 | bugsjoe
* What kind of the eraser can clean clearly?I've been use the eraser but the defect still present.
Electronics Forum | Thu Sep 19 21:17:50 EDT 2002 | Sam
We had encountered similar problem before. But the cause was found out to be the poor good plating, instead of contamination. The way we dealt with that was sending them to the supplier for rework. It may be the fastest and most relaibility way. Goo
Electronics Forum | Thu Sep 19 21:26:52 EDT 2002 | davef
Sam, You're correct. And that's what Joe would prefer to do with his contaminated boards, but he's trying to keeping line running, I believe.
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Wed Sep 18 22:53:24 EDT 2002 | davef
Please give us background on your situation, so that we can focus on the specifics, for instance: * This is a bare board problem, correct? Then, this contamination causes what the problems in your process? * What is the type [ie, FR4, CEM1, etc] of
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Sun Sep 22 13:14:56 EDT 2002 | scottefiske
Stop the lines...! Stop building defects and rework into your product. Contact Fab Supplier and have pipeline filled for small amount of replacement fabs to keep lines running and limiting production scheduling and impact. Request to have the board
Electronics Forum | Mon Sep 23 12:42:15 EDT 2002 | dragonslayr
yea - yippie- Scott's the man!!!! good answer - I support the notion that in the long run, stopping the line, getting the root cause determination, is not only effective but efficient. It is hard to do because we all are so used to fire fighting on
Electronics Forum | Thu Sep 19 02:45:33 EDT 2002 | bugsjoe
Thank you ur reply Dave. Let me explain our COB workflow: 1. unpack PCB (FR4,LPI,HASL)(the thickness of gold and nickel we can't be find)(No SMT before) 2. clean the pcb by rubber 3. blow the pcb by di-ionic gun 4. attach die by adhesive gel 5. cure