New Equipment | Rework & Repair Equipment
The BEST Gold Contact Replating Kit includes the tools you need for fast replating and modification of circuit contacts. Edge contacts may require replating if they are contaminated with solder or become scratched during handling or do not meet the m
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
Electronics Forum | Sun Jul 26 20:56:43 EDT 1998 | Masdi Muhammad
We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the goldfinger during touch-up or rework and to reduce the contamination we are planning to implement 'tapin
Electronics Forum | Mon Jul 27 17:09:20 EDT 1998 | Rin
| We are trying to reduce the number of units fail at system test due to flux on gold finger. We know so far that the flux is deposited onto the | goldfinger during touch-up or rework and to reduce the contamination we are | planning to imp
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2015-03-20 05:30:21.0
A Full Range of DDR4 UDIMM and SO-DIMM Modules Available for the Next Generation of Embedded
Technical Library | 2018-05-09 22:15:29.0
Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. The iNEMI technical subcommittee on creep corrosion has developed a flowers-of-sulfur (FOS) based test that is sufficiently well developed for consideration as an industry standard qualification test for creep corrosion. This paper will address the important question of how relative humidity affects creep corrosion. A creep corrosion tendency that is inversely proportional to relative humidity may allow data center administrators to eliminate creep corrosion simply by controlling the relative humidity in the data center,thus, avoiding the high cost of gas-phase filtration of gaseous contamination. The creep corrosion relative humidity dependence will be studied using a modified version of the iNEMI FOS test chamber. The design modification allows the achievement of relative humidity as low as 15% in the presence of the chlorine-releasing bleach aqueous solution. The paper will report on the dependence of creep corrosion on humidity in the 15 to 80% relative humidity range by testing ENIG (gold on electroless nickel), ImAg (immersion silver) and OSP (organic surface preservative) finished PCBs, soldered with organic acid flux.
BEST Inc master instructor Norman Mier demonstrates how to replate gold fingers using the BEST gold contact replating kit. In this video he demonstrates how to repair, prepare and replate the finger using a gold replating solution. If you want to lea
StencilQuik demonstration video. This breakthrough method allows you to simplify placement/replacement saving 50% or more of time required to rework BGAs or CSPs.This is a well developed BGA rework method. More on the StencilQuik(TM) process here:
Career Center | Shen Zhen, China | Management,Sales/Marketing
Working in GLORYPCB for 10 years.knowing electronic supply chain very well. especially for PCB PCBA assembly and other Electronic Manufacturing Service.Glorypcb is a professional electronic manufacturer located in Shenzhen with three facilities.offe
Precision PCB Services, Inc | https://precision-pcb-services-inc.com/collections/all?page=3
assembly Data Recovery Data recovery equipment Data recovery machines Data recovery services Digital Forensics FFG1759 Finger Contact Repair Flux Forensic Cell Phone Chip Off Machine Forensics Ginseng
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
, June 2006 [8] Conseil et al., “Contamination profile of Printed Circuit Board Assemblies in relation to soldering types and conformal coating”, Proc. EuroCorr 2014 [9] Piao and McIntyre, “Adventitious carbon growth on aluminium and gold–aluminium alloy
