1. Aluminum backed 2. Single sided 3. Thermal conductivity: 2.0W/MK 4. White solder mask/ no text 5. 1 OZ copper finished 6. 1.0mm finished thickness 7. Immersion gold 8. Hexagonal shape, punch profile
1) 4 layers board, 1.2mm thickness 2) Min. track width: 0.13mm 3) Min. track space: 0.12mm 4) Min. hole size: 0.3mm 5) Finish: immersion gold
Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 10layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold
Materials: FR-4 Copper Thickness: 2 oz Layer Count: 8 Layer, 2.4 mm Min. Hole Size: 16 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold
Materials: FR-5 Copper Thickness: 1 oz Layer Count: 8 layer, 1.6 mm Min. Hole Size: 4 mil Min.Line Width/Space: 3 mil Finishing: Immersion Gold
Materials: FR-4 Copper Thickness: 3 oz Layer Count: 6 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Immersion Gold
Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold + Carbon ink
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