Full Site - : gold finishing (Page 6 of 67)

High-density multilayer PCBs for Wireless LAN Card

High-density multilayer PCBs for Wireless LAN Card

New Equipment |  

Materials: FR-4 Layer count: 8 layers;40 mil thick Microvia (Laser drill) : 4 mil Min. line: 3 mil Application: Wireless LAN Card Finishing: Immersion gold

Ludee Circuits

TX-3

TX-3

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 10layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

AF-2

AF-2

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 5 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

GK-3

GK-3

New Equipment | Materials

Materials: FR-4 Copper Thickness: 2 oz Layer Count: 8 Layer, 2.4 mm Min. Hole Size: 16 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

XF-7

XF-7

New Equipment | Materials

Materials: FR-5 Copper Thickness: 1 oz Layer Count: 8 layer, 1.6 mm Min. Hole Size: 4 mil Min.Line Width/Space: 3 mil Finishing: Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

GK-4

GK-4

New Equipment | Materials

Materials: FR-4 Copper Thickness: 3 oz Layer Count: 6 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

QC-1

QC-1

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold + Carbon ink

Zhuhai Camtech Circuit Co., Ltd

8 Layer Mobile PCB

8 Layer Mobile PCB

New Equipment | Components

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder

Headpcb

8 layers PCB with BGA and golden fingers

8 layers PCB with BGA and golden fingers

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers

CYZON LIMITED

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED


gold finishing searches for Companies, Equipment, Machines, Suppliers & Information

Circuit Board, PCB Assembly & electronics manufacturing service provider

High Precision Fluid Dispensers
convection smt reflow ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Win Source Online Electronic parts

World's Best Reflow Oven Customizable for Unique Applications
pressure curing ovens

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...