Full Site - : gold finishing (Page 7 of 77)

GK-4

GK-4

New Equipment | Materials

Materials: FR-4 Copper Thickness: 3 oz Layer Count: 6 Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 6 mil Finishing : Immersion Gold

Zhuhai Camtech Circuit Co., Ltd

QC-1

QC-1

New Equipment | Materials

Materials: FR-4 Copper Thickness: 1 oz Layer Count: 4Layer, 1.6 mm Min. Hole Size: 12 mil Min.Line Width/Space: 8 mil Finishing: Immersion Gold + Carbon ink

Zhuhai Camtech Circuit Co., Ltd

8 Layer Mobile PCB

8 Layer Mobile PCB

New Equipment | Components

Specification: 8L(1+6+1) Material: FR-4 Board thickness: 1.0mm Final copper: 18um Solder mask color: Green Silkscreen: White Surface Finish: Immersion Gold Profile: Routing and stamp holes E-test: 100% Fixture Quality report: Solder

Headpcb

8 layers PCB with BGA and golden fingers

8 layers PCB with BGA and golden fingers

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.20MM Minimum drilled hole diameter: 8mils Copper thickness: 0.5oz Special process : 0.40MM BGA , golden fingers

CYZON LIMITED

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Technical Library | 2019-04-17 21:29:14.0

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Jet Propulsion Laboratory

Electrovert LFLT-1High Performance Lead Free Long Travel Probe

Electrovert LFLT-1High Performance Lead Free Long Travel Probe

Parts & Supplies | Assembly Accessories

Electrical : Current Rating (Amps): 6 Average Probe Resistance (mOhm): 10 Materials & Finishes : Barrel Material: Work-hardened Phosphor Bronze, Gold plated over hard Nickel Plunger Material: High performance alloy, LFRE proprietary plati

Shenzhen PTI Technology CO.,LTD

Technic Inc.

Industry Directory | Manufacturer

Manufacturer of advanced process chemistry for plating, masking and stripping. Custom manufacturing of automated equipment for electrodeposion including; hoist systems, reel-to-reel and continuous vertical processing equipment.

Caring Circuit Tech Limited

Industry Directory | Manufacturer

Caring Circuit specialises in the supply of prototype, small and medium-series PCBs factory in Shenzhen,China.We are a leading provider of custom Single layer,double layer,multilayer rigid PCBs.

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited


gold finishing searches for Companies, Equipment, Machines, Suppliers & Information