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The New S3088 ultra gold—the Gold Standard of 3D AOI

Industry News | 2016-03-07 20:31:29.0

Viscom today announced plans to introduce a new model of its successful S3088 ultra 3D AOI system family at the IPC APEX EXPO in Las Vegas. The S3088 ultra gold reaches image data rates of up to 3.6 gigapixels per second. The core of this system is the innovative high performance camera module XMplus with its outstanding, high throughput camera technology.

Viscom AG

Printing

Printing

Videos

Manufacturer: DEK Type: INF.01 (Infinity) Vintage: 2004 Serial number: 283904 SW: 07SP11 (Build 985B02, 08.12.2006) Equipment on printer • Standard print head(not Pro-Flow) • Gold camera • Blue stencilcleaner unit • Shor

OXYGEN SMD Kft.

Viscom AOI

Viscom AOI

Videos

High accuracy inspection guarantees reliable defect detection of die bonds, ball-to-wedge, wedge-to-wedge and security bonds Inspection of minimal wire thicknesses up to 15 µm Reliable differentiation of wire courses Recognition of defective bon

Viscom AG

850G Die Placement AOI

850G Die Placement AOI

New Equipment | Inspection

Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu

Machine Vision Products, Inc

What's New - MOLE MAP V3.10e

What's New - MOLE MAP V3.10e

Videos

New features highlight the ability for the customer to control what Process features are available.

Electronic Controls Design Inc. (ECD)

M.O.L.E.® MAP Thermal Profiler Software

M.O.L.E.® MAP Thermal Profiler Software

New Equipment | Software

M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E

Electronic Controls Design Inc. (ECD)

The Innovation Continues – Visit Viscom at APEX

Industry News | 2018-01-24 17:10:37.0

Viscom today announced plans to exhibit at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Calif. Constantly at the forefront of innovation for AOI, AXI and SPI, the company will show its X8011-II and X7056-II 3D X-ray inspection systems, along with the S3088 ultra gold, S3088 ultra chrome and S3088 SPI in Booth #1508.

Viscom AG

Rapid Response Strep A Tests

Industry News | 2009-10-16 11:28:02.0

Rapid Response Strep A Tests

BTNX Inc.

Henkel’s Hysol FP5201 NCP Enables New Copper Pillar Interconnect Technology

Industry News | 2010-07-29 14:45:16.0

Henkel’s non-conductive paste (NCP) solutions have long enjoyed a leading market position for traditional Gold – Gold flip chip processes. Recent NCP innovations from the global materials leader are also now enabling next-generation, high I/O fine-pitch technologies including new copper pillar (Cu Pillar) interconnects.

Henkel Electronic Materials

Virtual Industries Debuts VSPT Series of Small Parts Tips

Industry News | 2008-07-30 23:24:03.0

COLORADO SPRINGS, CO � July 29, 2008 � Virtual Industries Inc., a leading supplier of manual vacuum handling solutions, introduces the VSPT0803 small part tip.

Virtual Industries, Inc.


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