Full Site - : gold flow gf-12 (Page 10 of 14)

Washing Screens - Foam Everywhere, Help!

Electronics Forum | Fri Nov 18 09:21:41 EST 2016 | sumote

Lazy operators empowered by management. Sounds like you may have some nepotism? Since it falls to you to clean up someone else’s mess I have an idea for you. I once worked for a company that had a large wash sink with a hand sprayer very similar to

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 03:35:07 EST 2001 | Arul

We have few failures similar to the discussion in this thread, on a 50 Mil pitch, 30 Mil mill Ball PBGA. Would like to understand the mechanism of the BGA reflow process bit more. Appreciate your response to the following. 1.We sheared few solder ba

Re: OA core solder stranded wires

Electronics Forum | Tue Jan 05 18:07:53 EST 1999 | Dave F

| I am looking for information regarding post wave soldering of stranded wires into a circuit board using OA core wire solder. We do a final pass thru the cleaner after the hand soldering but I'm concerned about any OA flux residue that may have wic

Sn/Pb diffusion

Electronics Forum | Mon Apr 29 22:32:59 EDT 2002 | davef

See, I didn�t bite on you zinc diffusion trick that you tried to pull last week. Understand, in this response, I am NOT trying to bust you. I�m trying to determine what you are looking to understand. [Some times I get so locked into talking a cert

PCB Surface finish

Electronics Forum | Mon Jul 05 03:44:53 EDT 2004 | johnwnz

Dave, I'm going to disagree with you on the ENIG, it's my 3rd choice only just beating out OSP for that 4th spot. 1. Immersion Silver - cheaper than ENIG, as flat and no issues with Brittle interface (black pad) or Gold Embrittlement) Longer shelf l

Same wave process do not apply to all finish board

Electronics Forum | Fri Oct 14 09:58:13 EDT 2005 | patrickbruneel

Here's what I believe is happening. The main difference between the HASL boards and the gold plated boards is that HASL boards are pre-soldered. HASL boards need very little flux activity to get good hole fill and the machine settings have a wide pro

Re: BS

Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX

MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

Re: BGA problem: open after reflow

Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000

>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with

Re: Flux splattering during reflow

Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory

| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as


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