Industry Directory | Manufacturer
Auspi Enterprises Co., Ltd., one of the professional suppliers of printed circuits in China. We found your company info on the web knowing that you're dealing with electronics, which we think you may have demand on pcbs.
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
New Equipment | Assembly Services
No. Items technological Capability 1 Layer 1-20 layer 2 Copper thickness 0.5-4.0oz 3 Board thickness 0.2mm-6.0m
Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Industry News | 2013-09-25 16:06:25.0
On September 23, 2013, the National Development and Reform Commission (NDRC) of China issued a circular postponing the implementation of the regulation that would have eliminated cyanide-gold plating at the end of 2014.
Industry News | 2020-09-17 12:26:40.0
Today, IPC issued a blog post in support of the FY 2021 National Defense Authorization Act (NDAA) provisions that would bolster the resiliency and security of the electronics manufacturing ecosystem, including printed circuit board (PCB) fabrication and printed circuit board assembly (PCBA), the green-and-gold hardwiring at the core of all electronics systems. These provisions, approved in both the U.S. House and Senate, aim to improve the security of electronics purchased by the Defense Department.
Parts & Supplies | Pick and Place/Feeders
SMT Siemens feeder 3x8mm Gold FEEDER 00141099 used in smt machine Specification Part Numbre 2x8mm FEEDER 00141096 3x8mm Gold FEEDER 00141099 3x8mm Silver FEEDER 00141098 3x8mm SL FEEDER 00141088 12/16MM FEEDER 00141092 24/32MM FEEDER 00141093
Parts & Supplies | Pick and Place/Feeders
SMT Siemens feeder 3x8mm Gold FEEDER 00141099 used in smt machine Specification Part Numbre 2x8mm FEEDER 00141096 3x8mm Gold FEEDER 00141099 3x8mm Silver FEEDER 00141098 3x8mm SL FEEDER 00141088 12/16MM FEEDER 00141092 24/32MM FEEDER 00141093
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
Technical Library | 2014-07-24 16:26:34.0
Wire bonding a die to a package has traditionally been performed using either aluminum or gold wire. Gold wire provides the ability to use a ball and stitch process. This technique provides more control over loop height and bond placement. The drawback has been the increasing cost of the gold wire. Lower cost Al wire has been used for wedge-wedge bonds but these are not as versatile for complex package assembly. The use of copper wire for ball-stitch bonding has been proposed and recently implemented in high volume to solve the cost issues with gold. As one would expect, bonding with copper is not as forgiving as with gold mainly due to oxide growth and hardness differences. This paper will examine the common failure mechanisms that one might experience when implementing this new technology.
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
NanoSlic™ Gold is our top of the line spray on coating applied to our UltraSlic™ solder paste stencil, which gives previously unseen performance benefits in transfer efficiency. The NanoSlic™ Gold coating also gives the benefits of improved under-ste
Events Calendar | Tue Jan 23 00:00:00 EST 2018 - Tue Jan 23 00:00:00 EST 2018 | New Milford, Connecticut USA
FREE Webinar: Eliminate Circuit Board Problems and Failure Modes
Career Center | North San Jose, California USA | Engineering
My client, one of the leading Electronics Manufacturing Services (EMS) companies in the world has an urgent need for Optical Engineers in the Bay Area. They are looking for Process, Test, Component Engineers as well as Optical Technicians. These ne
Career Center | North San Jose, California USA | Sales/Marketing
My client, one of the leading Electronics Manufacturing Services (EMS) companies in the world has an urgent need for an Account Executive in the Bay Area. This is a newly created position due to explosive growth in their optics division. My client
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
Career Center | faridabad, India | Engineering,Production,Quality Control
My technical proficiency is extensive and is summarized on my resume (attached). As reflected on my resume (attached) I have completed my B-tech this Year.I am a fresher Electronics Engineer but having 6 months of PCB Assembling,PCB Manufacturing and
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 98, (#ts#)) SMT Express, Volume 4, Issue No. 2 - from SMTnet.com Volume 4, Issue No. 2 Thursday, Febuary 22, 2002 Featured
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
GPD Global | https://www.gpd-global.com/co_website/about-environment.php
. Conflict minerals include tin, tungsten, tantalum, and gold (collectively known as 3TG). The mining of these four minerals in the Democratic Republic of Congo (DRC
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/products/biomaterial-delivery-devices?con=t&page=30
. We have more than 30 years as a leading manufacturer of medical products for biomaterial applications and more, including the "gold standard" in biomaterial delivery devices: FibriJet®
