Electronics Forum: gold leaching of pcb pads (3)

Wetting problem of PCB after reflow soldering

Electronics Forum | Fri Sep 14 02:18:32 EDT 2001 | gsparka

Hi. After reflow soldering. There are lots of non wetting of leads. 71 b'd all are mounted resister,condensor,qfp,plcc,bga have got the defects so many. all defecs occured in the fine pitch ic. others are good. On some fine pitch pads not mou

Line release of post reflow AOI and AXI

Electronics Forum | Mon Sep 22 17:02:58 EDT 2008 | hegemon

You are on the right track Ismir. Essentially however, as the programmer of the machine, I am the one that creates the PCB with the errors to benchmark the settings for the machine. No secret lab though! :-) Easy enough for most any AOI machine to

Industry News: gold leaching of pcb pads (4)

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

What's usage of Via tenting for PCB design?

Industry News | 2019-11-05 22:07:01.0

Tenting a via refers to covering via with soldermask to enclose or skin over the opening. A via is a hole drilled into the PCB that allows multiple layers on the PCB to be connected to each other. A non tented via is just a via that is not covered with the soldermask layer. Leaving these vias exposed or covered has pros and cons depending on the your design and manufacturing requirements.

Headpcb

Technical Library: gold leaching of pcb pads (1)

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

Technical Library | 2019-04-17 21:29:14.0

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This paper presents the reliability of land grid array (LGA) component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Jet Propulsion Laboratory

Events Calendar: gold leaching of pcb pads (1)

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Surface Mount Technology Association (SMTA)

Express Newsletter: gold leaching of pcb pads (924)

SMTnet Express - October 3, 2013

SMTnet Express, October 3, 2013, Subscribers: 26314, Members: Companies: 13485, Users: 35243 Pyrolysis of Printed Circuit Boards by T. R. Mankhand, K. K. Singh, Sumit Kumar Gupta, Somnath Das; Indian Institute of Technology PCB is an essential

Partner Websites: gold leaching of pcb pads (52)

Top 10 SMT New Product Stories of 2014 - PCB Libraries Forum

PCB Libraries, Inc. | https://www.pcblibraries.com/forum/top-10-smt-new-product-stories-of-2014_topic1520_post6150.html

Top 10 SMT New Product Stories of 2014 - PCB Libraries Forum   Forum Home > General > General Discussion    New Posts    FAQ    Search    Events    Register    Login Top 10 SMT New Product Stories of 2014

PCB Libraries, Inc.

Solder Dictionary of Terms | Nordson EFD

ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/en/divisions/efd/resource-center/solder-glossary-of-terms

).   Bridging Formation of a solder alloy connection between two or more adjacent contacts.   Bumped Circuit Boards Bare printed circuit boards that have had solder paste deposited and reflowed on the pads prior to component installation

ASYMTEK Products | Nordson Electronics Solutions


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