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DEK and PacTech Join Forces for High-Volume Wafer Bumping Solution

Industry News | 2003-06-13 10:10:58.0

By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.

ASM Assembly Systems (DEK)

Symbion P36 Plus - SPI  System

Symbion P36 Plus - SPI System

New Equipment | Inspection

Symbion P36 is an inline high-speed API solution that delivers 100% coverage for improving your product quality and boosting your productivity. Post-Paste AOI Instant Programming Easy Gerber Import 2D/3D Laser Path Superior POP™ D

Orpro Vision GmbH

ABB CI610	3BHT300003R1

ABB CI610 3BHT300003R1

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

KOH YOUNG aSPIre3 3D SMT SPI machine

KOH YOUNG aSPIre3 3D SMT SPI machine

New Equipment | Inspection

KOH YOUNG aSPIre3 3D SMT SPI machine inspection range: 01005 PCB size:490x510mm Dimension:1000x1280x1727mm weight:600kg Product description: KOH YOUNG aSPIre3 3D SMT SPI machine, inspection range: 01005, PCB size:490x510mm, Dimension:1000x1280

qismt electronic co.,ltd

KOH YOUNG aSPIre3 3D SPI

KOH YOUNG aSPIre3 3D SPI

New Equipment | Inspection

KOH YOUNG aSPIre3 3D SPI inspection range: 01005 PCB size:490x510mm Dimension:1000x1280x1727mm weight:600kg Product description: KOH YOUNG aSPIre3 3D SPI, inspection range: 01005, PCB size:490x510mm, Dimension:1000x1280x1727mm, weight:600kg

qismt electronic co.,ltd

ABB CI534V04 3BSE010702R1

ABB CI534V04 3BSE010702R1

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

ABB CI541	3BSE014665R1

ABB CI541 3BSE014665R1

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

ABB CI560	3BUC98002R0001

ABB CI560 3BUC98002R0001

New Equipment | Industrial Automation

Contact: Sandy Lin Email:unity@mvme.cn Skype:onlywnn_1 Mobile(Whatsapp): (+86)-18020776786 QQ :2851195456 XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD Our services  Packing & Delivery 1)100% full New! - Original Factory Seal ! 2)Warranty: 12 m

XIAMEN YUEHANG COMPUTER ENGINEERING CO.LTD.

Press Release for Apex 2023

Industry News | 2023-01-16 07:16:27.0

Customers looking for leading-edge test solutions can come to Seica's booth 2511 and view the newest line of Flying Probe test on the market in the form of the PILOT VX platform, bed of nails ICT solutions, the Compact LR, and Mini200 and the latest conformal coat inspection systems, the Dragonfly.

SEICA SpA

Wave Soldering Machine KTM-350

Wave Soldering Machine KTM-350

New Equipment | Wave Soldering

Wave Soldering Machine KTM-350 Preheating zone 4 zones Solder pot capacity Approx.450kg Weight Approx.1500kg Dimension 4500*1600*1730 Product description: Wave Soldering Machine KTM-350, Preheating zone 4 zones, Solder pot capacity Approx.450k

Flasonsmt Co.,ltd


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