Electronics Forum | Thu Jul 01 20:56:57 EDT 1999 | Dave F
| | | | | Could somebody tell me what means Leaching, ie: "Leaching of terminal end face exposing the ceramic"? | | | | | | | | | Roberto: Leaching, according to the SMTnet Library of Terms: | | | | | | | | Leaching. Dissolution of a metal coating
Electronics Forum | Mon Oct 23 06:51:36 EDT 2000 | fastech6
I have a problem with solder getting into exposed gold pads. What is the best rework procedure for removing the solder and restoring the gold condition of the pad? At the moment, we are also covering the gold pad with kapton tape prior to solder
Electronics Forum | Sat Jun 16 07:48:09 EDT 2007 | grantp
Hi, We are using emerson gold, and I have not seen any evidence of black pad, as the pads are clean and gold colored when the part comes off. That is what worried me, as I would have thought that if the solder melted correctly, it would have stuck t
Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Thu Feb 27 16:23:37 EST 2020 | dwl
http://www.circuitnet.com/news/uploads/3/Comparing-Soldering-Results-of-ENIG-and-EPIG-Post-Steam-Exposure.pdf Years ago, I battled this problem. ENIG PCBs reflowed with active WS flux. We built one side, and then washed them because they were going
Electronics Forum | Mon Mar 30 07:41:06 EST 1998 | Earl Moon
| Hi, | We have encountered de-wetting issues with gold plated components( SMT LEDs ). | The problem comes and go and we yet to locate the root cause ( process, component or solder paste etc ). | The rest of the components on the boards are not havi
Electronics Forum | Thu Sep 16 20:55:35 EDT 1999 | Dave F
| | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a re
Electronics Forum | Wed Apr 13 18:28:21 EDT 2005 | RT
We have a situation where our customer returned a device (BGA) with a missing solder ball. The process is Copper-Nickel-Gold-Solderball. EDX revealed that no trace of gold nor solder material (lead-free balls). Could poor Au plating/adhesion cause
Electronics Forum | Tue Apr 01 17:29:58 EST 2003 | davef
R1: So if I understand you right, it could be possible that gold dissolved, but the ball still didn't wet to the underlying nickel. D1: Correct. The gold dissolves into the solder first. The solder wets to the nickel second. If you nickel is corro
Electronics Forum | Tue Feb 29 13:18:16 EST 2000 | Steve Schrader
We have what appears to be a recurring problem. On immersion gold boards only, we are having solderability problems. After reflow, selected parts can be popped right off the board. There is then a dark haze left on the pad. The paste on the compon
