Technical Library | 2023-01-10 20:15:42.0
Over the past years there has been consistent growth in the use of electroless nickel / immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA, CSP, QFP and COB and more recently gathered considerable interest as a low cost under-bump metallization for flip chip bumping application. One of the largest users for this finish has been the telecommunication industry, were millions of square meters of PCBs with ENIG have been successfully used. The nickel layer offers advantages such as multiple soldering cycles and hand reworks without copper dissolution being a factor. The nickel also acts as a reinforcement to improve through-hole and blind micro via thermal integrity. In addition the nickel layer offers advantages such as co-planarity, Al-wire bondability and the use as contact surface for keypads or contact switching. Especially those pads, which are not covered by solder need a protective coating in corrosive environment – such as high humidity or pollutant gas.
Industry News | 2011-10-21 13:18:46.0
AIM announces that its Mexican facility, Soldadura de Mexico, has received its Clean Industry Certification.
Industry News | 2012-09-25 16:25:15.0
Stevenage Circuits Ltd. offers Semblant Plasma Finish to address growing OEM demand for PCB surface finish advancements
Industry News | 2013-12-10 12:30:48.0
The total global gross value market for hybrid and pure electric vehicles will reach US$334 Billion within the decade, from a current value of US$69 Billion, forecast analysts IDTechEx. This will primarily consist of large or very heavy duty vehicles, neither of which is primarily bought on up-front price. These military, industrial and commercial vehicles are evenly split between on-road and off-road types, but with a multi-billion dollar marine sector coming up fast. All these vehicles are primarily bought on Total Cost of Ownership TCO and performance.
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
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