Full Site - : gold thickness wire bond (Page 11 of 27)

CyberOptics to Showcase High-Precision Inspection and Metrology Solutions at the SEMI Connecting Heterogeneous Systems Summit

Industry News | 2021-08-13 12:16:35.0

CyberOptics® Corporation (NASDAQ: CYBE) will feature the WX3000™ metrology and inspection system with MRS™ sensor technology, and high-precision sensors for semiconductor tool set-up and diagnostics at the VirtualConnecting Heterogeneous Systems Summit Sept. 1-3, 2021.

CyberOptics Corporation

Endicott Interconnect Technologies, Inc. Fabricates Award Winning Printed Circuit Board

Industry News | 2008-02-19 10:13:23.0

Endicott Interconnect Technologies, Inc. (EI) announced today that it has fabricated an award winning, printed circuit board for IBM Zurich Research Laboratory (ZRL).

i3 Electronics

Heraeus Electronics Receives Bosch Global Supplier Award

Industry News | 2023-08-07 10:25:42.0

Heraeus Electronics has been honored by Bosch, a leading global supplier of technology and services, with the renowned Bosch Global Supplier Award in the category "Raw Material and Components" for its exceptional performance.

Heraeus

Indium Corporation Announces Updates to China Leadership Team

Industry News | 2024-01-29 11:29:04.0

Indium Corporation is pleased to announce the promotions of Taylor Wang and Walter Wang, key members of its China-based leadership team. Taylor Wang has assumed the role of Associate Director, China Sales, while Walter Wang has taken on the position of Associate Director, Operations.

Indium Corporation

Nordson DAGE’s Keith Bryant Will Present Recent Advances in X-ray Technology for Electronics Applications at the SMALED Conference

Industry News | 2012-09-05 13:53:47.0

Nordson DAGE announces that Keith Bryant, Global Sales Director X-ray Systems, will present “Recent Advances in X-ray Technology” at the upcoming Surface Mount & Light Emitting Diodes (SMALED) Conference

Nordson DAGE

Viscom Presents vConnect and Other Highlights at the SMTconnect and PCIM Europe Trade Fairs

Industry News | 2022-04-20 14:41:47.0

From 3D SPI to 3D AOI and 3D Bond to 3D AXI and 3D MXI, Viscom AG will showcase a wide range of innovative solutions for intelligently networked quality control at the SMTconnect international trade fair for electronics manufacturing. A special highlight features new remote service offerings under the vConnect brand. At PCIM Europe, where power electronics are in the foreground, Viscom is particularly featuring 3D AXI.

Viscom AG

Ball Grid Array (BGA) Package

Industry News | 2018-12-08 03:31:22.0

Ball Grid Array (BGA) Package

Flason Electronic Co.,limited

High-Quality Microfocus X-ray Tubes from Viscom for the First Time at the International Trade Fair Control

Industry News | 2022-04-13 10:08:36.0

Viscom AG will present a selection of its latest microfocus X-ray tubes at Control in Stuttgart, Germany. Thanks to their impressive flexibility, a previously unattained spectrum of tasks can now be covered with one and the same X-ray source – from the inspection of small, filigree objects and time-optimized series inspections to the radiography of large and massive components.

Viscom AG

Viscom Inspection Technologies Demonstrated at productronica in Munich

Industry News | 2021-10-14 13:49:10.0

Viscom AG is presenting its latest inspection systems and solutions for the widest possible range of the electronics industry's testing requirements at this year's productronica. The company's experts will be on Stand A2.177 to explain to visitors how ultra-precise defect detection, exact measurements and intelligent evaluation during manufacture blend seamlessly together into perfect and sustainable inspection processes.

Viscom AG


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