Electronics Forum | Sun Jan 22 20:45:24 EST 2006 | yihui
Hello Sergey, thanks for your input. The capillary i'm using seems to pick up material from the bond surface fairly quickly. Can't think of a solution at the moment. regards, david.
Electronics Forum | Tue Dec 27 14:51:49 EST 2005 | davef
What's the issue and situation?
Electronics Forum | Fri Jan 20 02:34:16 EST 2006 | yihui
Hi, i'm david, new to this forum. Came across your posting about using a delvotec bonder to TS bond to a ENIG pad. Given that the immersion gold layer is thin, does the capillary scrub through the gold layer to expose the underlying nickel? Does your
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Fri Aug 17 11:55:31 EDT 2001 | davef
5uin. Your nickel thickness is fine. Although if you wanted to trade costs, consider giving-up nickel to 150uin thickness, while increasing the gold thickness. Gold over electroless nickel creates brittle joints because of phosphorous in the nicke
Electronics Forum | Mon Apr 16 09:12:23 EDT 2007 | davef
Standard for appearance: J-STD-001 and IPC-A-610 committees eliminated the requirement that solder connections be "bright and shiny". Certain solderability protections; such as Au, NiPd, NiPdAu; can affect the surface texture of a solder connection,
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef
Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend
Electronics Forum | Tue Feb 20 16:31:49 EST 2001 | davef
Let�s be basic. The two most common causes of BGA opens that we talk about here are: 1 Gold thickness and 2 Black pad. Given the thickness of gold that you talking about, it�s reasonable to consider thickness as the first alternative to investigat
